MPC8250AZUPIBC Freescale Semiconductor, MPC8250AZUPIBC Datasheet - Page 56

• Manufacturer Part Number: MPC8250AZUPIBC
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of MPC8250AZUPIBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 300MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 300 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 300MHz
• Embedded Interface Type: I2C, JTAG, SPI, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 480
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 300MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 2.2V
• Operating Supply Voltage (min): 1.9V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• For Use With: CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package Description
5.1
Package parameters are provided in
5.2
This section discusses the TBGA and PBGA package dimensions.
56
Package
ZU
VV
ZO
VR
Package Parameters
Mechanical Dimensions
MPC8250
Devices
37.5 × 37.5
27 × 27
Outline
(mm)
MPC8250 Hardware Specifications, Rev. 2
Table
Table 23. Package Parameters
TBGA (Pb free)
PBGA (Pb free)
23.
PBGA
TBGA
Type
Interconnects
480
516
(mm)
Pitch
1.27
1
Nominal Unmounted
Freescale Semiconductor
Height (mm)
1.55
2.25