MPC8349EVVALFB Freescale Semiconductor, MPC8349EVVALFB Datasheet - Page 3

• Manufacturer Part Number: MPC8349EVVALFB
• Description: IC MPU POWERQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8349EVVALFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 667 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.36V
• Operating Supply Voltage (min): 1.24V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: TBGA
• For Use With: MPC8349E-MITX-GP - KIT REFERENCE PLATFORM MPC8349EMPC8349E-MITXE - BOARD REFERENCE FOR MPC8349MPC8349EA-MDS-PB - KIT MODULAR DEV SYSTEM MPC8349E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Freescale Semiconductor
•
•
•
Double data rate, DDR1/DDR2 SDRAM memory controller
— Programmable timing supporting DDR1 and DDR2 SDRAM
— 32- or 64-bit data interface, up to 400 MHz data rate
— Up to four physical banks (chip selects), each bank up to 1 Gbyte independently addressable
— DRAM chip configurations from 64 Mbits to 1 Gbit with ×8/×16 data ports
— Full error checking and correction (ECC) support
— Support for up to 16 simultaneous open pages (up to 32 pages for DDR2)
— Contiguous or discontiguous memory mapping
— Read-modify-write support
— Sleep-mode support for SDRAM self refresh
— Auto refresh
— On-the-fly power management using CKE
— Registered DIMM support
— 2.5-V SSTL2 compatible I/O for DDR1, 1.8-V SSTL2 compatible I/O for DDR2
Dual three-speed (10/100/1000) Ethernet controllers (TSECs)
— Dual controllers designed to comply with IEEE 802.3™, 802.3u™, 820.3x™, 802.3z™,
— Ethernet physical interfaces:
— Buffer descriptors are backward-compatible with MPC8260 and MPC860T 10/100
— 9.6-Kbyte jumbo frame support
— RMON statistics support
— Internal 2-Kbyte transmit and 2-Kbyte receive FIFOs per TSEC module
— MII management interface for control and status
— Programmable CRC generation and checking
Dual PCI interfaces
— Designed to comply with PCI Specification Revision 2.3
— Data bus width options:
— PCI 3.3-V compatible
— PCI host bridge capabilities on both interfaces
— PCI agent mode on PCI1 interface
— PCI-to-memory and memory-to-PCI streaming
— Memory prefetching of PCI read accesses and support for delayed read transactions
— Posting of processor-to-PCI and PCI-to-memory writes
802.3ac™ standards
– 1000 Mbps IEEE Std. 802.3 GMII/RGMII, IEEE Std. 802.3z TBI/RTBI, full-duplex
– 10/100 Mbps IEEE Std. 802.3 MII full- and half-duplex
programming models
– Dual 32-bit data PCI interfaces operating at up to 66 MHz
– Single 64-bit data PCI interface operating at up to 66 MHz
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Overview
3