MPC8349EVVALFB Freescale Semiconductor, MPC8349EVVALFB Datasheet - Page 74

• Manufacturer Part Number: MPC8349EVVALFB
• Description: IC MPU POWERQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8349EVVALFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 667 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.36V
• Operating Supply Voltage (min): 1.24V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: TBGA
• For Use With: MPC8349E-MITX-GP - KIT REFERENCE PLATFORM MPC8349EMPC8349E-MITXE - BOARD REFERENCE FOR MPC8349MPC8349EA-MDS-PB - KIT MODULAR DEV SYSTEM MPC8349E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Thermal
1
2
20 Thermal
This section describes the thermal specifications of the MPC8349EA.
20.1
Table 63
74
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (at 2 m/s) on single-layer board (1s)
Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
No.
306
405
504
Ref
The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
1
SPMF
0011
0100
0101
provides the package thermal characteristics for the 672 35 × 35 mm TBGA of the MPC8349EA.
Thermal Characteristics
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
RCWL
0000110
0000101
0000100
CORE
PLL
Characteristic
(MHz)
Clock
Input
Freq
Table 62. Suggested PLL Configurations (continued)
Table 63. Package Thermal Characteristics for TBGA
400 MHz Device
2
(MHz)
CSB
Freq
—
—
—
(MHz)
Core
Freq
(MHz)
Clock
Input
Freq
533 MHz Device
2
(MHz)
CSB
Freq
—
—
—
Symbol
R
R
R
R
R
R
R
R
θJMA
θJMA
θJMA
θJMA
θJMA
θJC
θJA
θJB
(MHz)
Core
Freq
Value
(MHz)
3.8
1.7
Clock
14
11
11
Input
Freq
8
9
7
66
66
66
Freescale Semiconductor
667 MHz Device
2
(MHz)
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Freq
CSB
Unit
200
266
333
Notes
(MHz)
Core
Freq
600
667
667
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
4
5