MPC8555EVTAPF Freescale Semiconductor, MPC8555EVTAPF Datasheet - Page 70

• Manufacturer Part Number: MPC8555EVTAPF
• Description: IC MPU POWERQUICC III 783-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8555EVTAPF

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 833MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• For Use With: MPC8555CDS - BOARD EVALUATION CDS FOR 8555CWH-PPC-8555N-VX - BOARD EVAL QUICCSTART MPC8555CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540CWH-PPC-8555N-VE - EVALUATION SYSTEM QUICC MPC8555E
• Lead Free Status / RoHS Status: Not applicable / RoHS Compliant
• Features: -

Thermal
The system board designer can choose between several types of heat sinks to place on the MPC8555E.
There are several commercially-available heat sinks from the following vendors:
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Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
Figure 43. Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Interface Material
Heat Sink
Heat Sink
Lid
Clip
Die
Printed-Circuit Board
FC-PBGA Package
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