TDA8034AT/C1,112 NXP Semiconductors, TDA8034AT/C1,112 Datasheet - Page 13

• Manufacturer Part Number: TDA8034AT/C1,112
• Description: IC SMART CARD INTERFACE 16SOIC
• Manufacturer: NXP Semiconductors

Specifications of TDA8034AT/C1,112

• Controller Type: Smart Card Interface
• Interface: Analog
• Voltage - Supply: 3V, 5V
• Current - Supply: 65mA
• Operating Temperature: -25°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
9. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
10. Thermal characteristics
Table 6.
TDA8034T_TDA8034AT
Product data sheet
Symbol
V
V
V
V
T
P
T
T
V
Symbol
R
stg
j
amb
DDP
DD
DD(INTF)
I
tot
ESD
th(j-a)
Package name
SO16
Limiting values
Thermal characteristics
Parameter
power supply voltage
supply voltage
interface supply voltage
input voltage
storage temperature
total power dissipation
junction temperature
ambient temperature
electrostatic discharge voltage
If pin CMDVCCN is HIGH for more than 30 ms (card inactive), and if the card needs to be
activated at 3 V, the sequence shown in
LOW for t1 (200 μs < t1 < 700 μs), and then HIGH for t2 (200 μs < t2 < 15 ms) before
going LOW.
Remark: All card contacts are protected against any short-circuit to any other card
contact. Stress beyond the levels indicated in
the device. This is a short-term stress rating only and under no circumstances implies
functional operation under long-term stress conditions.
Fig 12. Card activation, V
Parameter
thermal resistance from junction to ambient
All information provided in this document is subject to legal disclaimers.
CMDVCCN
Conditions
pin V
pin V
pin V
pins CMDVCCN, CLKDIV1, RSTIN, OFFN,
XTAL1, XTAL2, I/OUC
card contact pins PRESN, I/O, RST and
CLK
T
Human Body Model (HBM) on card pins I/O,
RST, V
application
Human Body Model (HBM); all other pins
Machine Model (MM); all pins
Field Charged Device Model (FCDM);
all pins
Rev. 3.0. — 17 January 2011
amb
V
CC
DDP
DD
DD(INTF)
= −25 °C to +85 °C
CC
CC
3 V or 5 V
= 3 V, t0 > 15 ms
, CLK, PRESN; within typical
t0
TDA8034T; TDA8034AT
Figure 12
Table 5
applies: pin CMDVCCN must be set
t1
Conditions
in free air
can cause permanent damage to
t2
001aal000
Min
−0.3
−0.3
−0.3
−0.3
−0.3
−55
-
-
−25
−6
−2
−200
−500
Smart card interface
3 V
© NXP B.V. 2011. All rights reserved.
Typ
94
+125
Max
+6
+4.6
+4.6
+4.6
+6
+150
0.25
+85
+6
+2
+200
+500
Unit
K/W
Unit
V
V
V
V
V
°C
W
°C
°C
kV
kV
V
V
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