MC33889BDWR2 Freescale Semiconductor, MC33889BDWR2 Datasheet - Page 56

• Manufacturer Part Number: MC33889BDWR2
• Description: IC SYSTEM BASE W/CAN 28-SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MC33889BDWR2

• Controller Type: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 18 V
• Current - Supply: 45mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
single heat source (P), a single junction temperature (T
(R
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 34. Thermal Performance Comparison
56
33889
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Notes
Ρ
Ρ
Ρ
Ρ
θJA
This thermal addendum is provided as a supplement to the MC33889 technical
The MC33889 is offered in a 28 pin SOICW, single die package. There is a
The stated values are solely for a thermal performance comparison of one
θJA
θJB
θJA
θ
1.
2.
3.
4.
5.
ϑΧ
).
Thermal Resistance
(1) (2)
(2) (3)
(1) (4)
(5)
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
T
J
=
R
θJA
.
P
[°C/W]
42
11
69
23
J
), and thermal resistance
Figure 23. Surface Mount for SOIC Wide Body
NOTE FOR PACKAGE DIMENSIONS,
REFER TO THE 33889 DEVICE DATASHEET.
18.0 mm x 7.5 mm Body
Non-Exposed Pad
20 Terminal SOICW
Analog Integrated Circuit Device Data
1.27 mm Pitch
EG SUFFIX (PB-FREE)
33889DW
33889EG
28-PIN SOICW
DWB SUFFIX
98ASB42345
SOICW
28-PIN
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