HIN232ACP Intersil, HIN232ACP Datasheet - Page 9

• Manufacturer Part Number: HIN232ACP
• Description: IC TXRX RS-232 5V HS 16-DIP
• Manufacturer: Intersil
• Type: Transceiverr

Specifications of HIN232ACP

• Number Of Drivers/receivers: 2/2
• Protocol: RS232
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
feature must be located within the crosshatched area.
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
E
-C-
-B-
B S
A
9
H
A1
α
0.10(0.004)
0.25(0.010)
M
L
h x 45°
B
M
C
HIN232A
M16.3
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AA ISSUE C)
0.0926
0.0040
0.013
0.0091
0.3977
0.2914
0.394
0.010
0.016
MIN
0°
0.050 BSC
INCHES
16
0.1043
0.0118
0.0200
0.0125
0.4133
0.2992
0.419
0.029
0.050
MAX
8°
10.10
10.00
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MILLIMETERS
MIN
0°
1.27 BSC
16
10.50
10.65
2.65
0.30
0.51
0.32
7.60
0.75
1.27
MAX
8°
Rev. 1 6/05
NOTES
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3
4
5
6
7
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