HIN238CBZ Intersil, HIN238CBZ Datasheet - Page 3

• Manufacturer Part Number: HIN238CBZ
• Description: IC 4DRVR/4RCVR RS232 5V 24-SOIC
• Manufacturer: Intersil
• Type: Transceiverr

Specifications of HIN238CBZ

• Number Of Drivers/receivers: 4/4
• Protocol: RS232
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
HIN232CB*
HIN232CBZ*
(Note)
HIN232CP
HIN232CPZ
(Note)
HIN232IB*
HIN232IBZ*
(Note)
HIN232IP
HIN232IPZ
(Note)
HIN236CB
HIN236CBZ
(Note)
HIN237CB*
HIN237CBZ*
(Note)
HIN238CB*
HIN238CBZ*(Note)
HIN238CP
HIN238IB
HIN238IBZ
(Note)
HIN239CB*
HIN239CBZ*
(Note)
HIN239CP
HIN239CPZ
(Note)
HIN240CN
HIN240CNZ*
(Note)
HIN241CA
HIN241CAZ
(Note)
HIN241CB*
HIN241CBZ*
(Note)
HIN241IB
HIN241IBZ
(Note)
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NUMBER
PART
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
3
232CB
HIN232CBZ
HIN232CP
HIN232CPZ
HIN232IB
HIN232IBZ
HIN232IP
HIN232IPZ
HIN236CB
HIN236CBZ
HIN237CB
HIN237CBZ
HIN238CB
HIN238CBZ
HIN238CP
HIN238IB
HIN238IBZ
HIN239CB
HIN239CBZ
HIN239CP
HIN239CPZ
HIN240CN
HIN240CNZ
HIN241CA
HIN241CAZ
HIN241CB
HIN241CBZ
HIN241IB
HIN241IBZ
MARKING
PART
TEMP. RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
(°C)
16 Ld SOIC
16 Ld SOIC
(Pb-free)
16 Ld PDIP
16 Ld PDIP**
(Pb-free)
16 Ld SOIC
16 Ld SOIC
(Pb-free)
16 Ld PDIP
16 Ld PDIP**
(Pb-free)
24 Ld SOIC
24 Ld SOIC
(Pb-free)
24 Ld SOIC
24 Ld SOIC
(Pb-free)
24 Ld SOIC
24 Ld SOIC
(Pb-free)
24 Ld PDIP
24 Ld SOIC
24 Ld SOIC
(Pb-free)
24 Ld SOIC
24 Ld SOIC
(Pb-free)
24 Ld PDIP
24 Ld PDIP**
(Pb-free)
44 Ld MQFP
44 Ld MQFP
(Pb-free)
28 Ld SSOP
28 Ld SSOP
(Pb-free)
28 Ld SOIC
28 Ld SOIC
(Pb-free)
28 Ld SOIC
28 Ld SOIC
(Pb-free)
PACKAGE
M16.3
M16.3
E16.3
E16.3
M16.3
M16.3
E16.3
E16.3
M24.3
M24.3
M24.3
M24.3
M24.3
M24.3
E24.3
M24.3
M24.3
M24.3
M24.3
E24.3
E24.3
Q44.10X10
Q44.10X10
M28.209
M28.209
M28.3
M28.3
M28.3
M28.3
DWG. #
PKG.
September 26, 2008
FN3138.16