MT29F1G08ABBDAH4-IT:D Micron Technology Inc, MT29F1G08ABBDAH4-IT:D Datasheet - Page 12

• Manufacturer Part Number: MT29F1G08ABBDAH4-IT:D
• Manufacturer: Micron Technology Inc

Specifications of MT29F1G08ABBDAH4-IT:D

• Cell Type: NAND
• Density: 8Gb
• Interface Type: Parallel
• Address Bus: 27b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: VFBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 1.95V
• Word Size: 8b
• Number Of Words: 128M
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 63
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Package Dimensions
Figure 5: 48-Pin TSOP – Type 1, CPL
PDF: 09005aef83e5ffed
m68a.pdf – Rev. D 06/10 EN
12.00 ±0.08
24
1
0.15
+0.03
-0.02
Note:
1. All dimensions are in millimeters.
20.00 ±0.25
18.40 ±0.08
See detail A
12
1.20 MAX
Micron Technology, Inc. reserves the right to change products or specifications without notice.
48
25
1Gb x8, x16: NAND Flash Memory
0.25
for reference only
0.50 TYP
for reference
only
0.10
0.10
+0.10
-0.05
Package Dimensions
© 2010 Micron Technology, Inc. All rights reserved.
Package width and length
do not include mold
protrusion. Allowable
protrusion is 0.25 per side.
Mold compound:
Plated lead finish:
Detail A
Epoxy novolac
100% Sn
0.27 MAX
0.17 MIN
0.50 ±0.1
0.80
0.25
Gage
plane