AU5790D14/N,118 NXP Semiconductors, AU5790D14/N,118 Datasheet - Page 15

• Manufacturer Part Number: AU5790D14/N,118
• Description: IC CAN TXRX SINGLE WIRE 14SOIC
• Manufacturer: NXP Semiconductors
• Series: AUr
• Type: Transceiverr

Specifications of AU5790D14/N,118

• Number Of Drivers/receivers: 1/1
• Protocol: CAN
• Voltage - Supply: 5.3 V ~ 27 V
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935277456118; AU5790D14/N-T; AU5790D14/N-T

1. The High Conductance board is based on modeling done to EIA/JEDEC Standard JESD51-7. The board emulated contains two one ounce
2. The Low Conductance board is based on modeling done to EIA/JEDEC Standard EIA/JESD51-3. The board does not contain any ground
3. The Very Low Conductance board is based on the EIA/JESD51-3, however the thickness of the surface conductors has been reduced to
4. The above mentioned JEDEC specifications are available from: http://www.jedec.org/
Philips Semiconductors
Table 3 shows the maximum power dissipation of an AU5790 without tripping the thermal overload protection, for specified combinations of
package, board configuration, and ambient temperature.
Table 3. Maximum power dissipation
NOTES:
2001 May 18
SO-8 on High
Conductance Board
Conductance Board
SO-8 on Low
Conductance Board
Conductance Board
SO-8 on Very Low
Conductance Board
Conductance Board
SO-14 on High
Conductance Board
Conductance Board
SO-14 on Low
Conductance Board
Conductance Board
SO-14 on Very Low
Conductance Board
Conductance Board
Single wire CAN transceiver
thick copper ground planes, and top surface copper conductor traces of two ounce (0.071 mm thickness of copper).
planes, and the top surface copper conductor traces of two ounce (0.071 mm thickness of copper).
0.035 mm (also referred to as 1.0 Ounce copper).
Board Type
Additional Foil Area for
Additional Foil Area for
Normal traces
225 Sq. mm of copper
foil attached to pin 8.
Normal traces
225 Sq. mm of copper
attached to pin 8.
Normal traces
225 Sq. mm of copper
attached to pin 8.
Normal traces
105 Sq. mm of copper
attached to each of pins
1, 7, 8, & 14.
Normal traces
105 Sq. mm of copper
attached to each of pins
1, 7, 8, & 14.
Normal traces
105 Sq. mm of copper
attached to each of pins
1, 7, 8, & 14.
Heat Dissipation
Thermal Resistance
K/W
103
163
119
194
135
103
126
82
63
50
70
82
15
JA
T
a
= 85 C
1032
1300
mW
631
793
399
546
335
481
631
929
516
793
Power Dissipation Max.
P
tot
T
a
= 125 C
AU5790
mW
243
305
153
210
129
185
397
500
243
357
198
305
Product data