ISL81485IU Intersil, ISL81485IU Datasheet - Page 3

• Manufacturer Part Number: ISL81485IU
• Description: IC TXRX RS485/422 5V HS 8-MSOP
• Manufacturer: Intersil
• Type: Transceiverr

Specifications of ISL81485IU

• Number Of Drivers/receivers: 1/1
• Protocol: RS422, RS485
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum Ratings
V
Input Voltages
Input / Output Voltages
Short Circuit Duration
Operating Conditions
Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
DC CHARACTERISTICS
Driver Differential V
Driver Differential V
Change in Magnitude of Driver
Differential V
Complementary Output States
Driver Common-Mode V
Change in Magnitude of Driver
Common-Mode V
Complementary Output States
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
Input Current (A/Y, B/Z) (Note 5)
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis
Receiver Output High Voltage
Receiver Output Low Voltage
Three-State (high impedance)
Receiver Output Current
Receiver Input Resistance
No-Load Supply Current, Note 3
Driver Short-Circuit Current,
V
1. θ
CC
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ISL81485IX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
O
= High or Low
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
PARAMETER
OUT
for
OUT
OUT
OUT
for
(with load)
OUT
(no load)
3
Test Conditions: V
Note 2
SYMBOL
∆V
∆V
I
V
V
∆V
I
OSD1
V
V
V
V
V
I
I
OZR
R
I
V
OD1
OD2
IN1
IN2
CC
OC
OH
TH
OL
IH
IL
IN
OD
OC
TH
R = 50Ω (RS-422) (Figure 1A)
R = 27Ω (RS-485) (Figure 1A)
R
R = 27Ω or 50Ω (Figure 1A)
R = 27Ω or 50Ω (Figure 1A)
R = 27Ω or 50Ω (Figure 1A)
DE, DI, RE
DE, DI, RE
DE, DI, RE
DE = 0V, V
4.5 to 5.5V
-7V ≤ V
V
I
I
0.4V ≤ V
-7V ≤ V
DE = V
O
O
DI, RE = 0V or V
CM
D
= -4mA, V
= -4mA, V
CC
= 60Ω, -7V ≤ V
= 0V
o
= 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V
CC
CC
C to 85
CM
CM
O
, -7V ≤ V
+0.5V)
≤ 2.4V
CC
≤ 12V
≤ 12V
ID
ID
o
TEST CONDITIONS
= 0V or
ISL81485
= 200mV
= 200mV
C
CC
CM
Y
or V
≤ 12V (Figure 1B)
Z
V
V
DE = V
DE = 0V
≤ 12V (Note 4)
IN
IN
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature (Plastic Package) . . . . . . . 150
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
(Lead Tips Only)
= 12V
= -7V
CC
TEMP
(
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
o
25
C)
MIN
-0.8
-0.2
2.5
1.5
12
60
-1
2
2
4
-
-
-
-
-
-
-
-
-
-
-
CC
TYP
0.01
0.01
2.5
0.8
= 5V, T
40
3
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
A
MAX
V
250
= 25
0.2
0.2
0.8
0.2
0.4
2.2
±1
CC
5
3
1
1
1
-
-
-
-
-
-
-
o
θ
C to 150
o
JA
C,
105
140
UNITS
(
o
mA
mA
mV
mA
mA
mA
µA
µA
kΩ
C/W)
V
V
V
V
V
V
V
V
V
V
V
V
o
o
o
C
C
C