LH7A404N0F092B3 NXP Semiconductors, LH7A404N0F092B3 Datasheet - Page 70

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LH7A404N0F092B3

Manufacturer Part Number
LH7A404N0F092B3
Description
Microcontrollers (MCU) LCD USB FS/HOST MMU LFBGA324
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LH7A404N0F092B3

Data Bus Width
32 bit
Program Memory Type
ROMLess
Data Ram Size
80 KB
Interface Type
AC97, EBI, IrDA, Microwire, SPI, SSI, SSP, UART, USB
Maximum Clock Frequency
266 MHz
Number Of Programmable I/os
64
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
LFBGA
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 9 Channel
Lead Free Status / Rohs Status
 Details
Other names
LH7A404N0F092B3;55

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LH7A404N0F092B3
Manufacturer:
TI
Quantity:
101
Part Number:
LH7A404N0F092B3
Manufacturer:
Sharp Microelectronics
Quantity:
135
Part Number:
LH7A404N0F092B3,55
Manufacturer:
NXP Semiconductors
Quantity:
10 000
LH7A404
PACKAGE SPECIFICATIONS
70
LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT1021-1
OUTLINE
VERSION
max
1.7
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
Y
V
T
P
K
H
F
D
B
1.35
1.15
A
W
U
R
N
L
G
E
C
A
J
2
IEC
1
2
0.5
0.4
b
3
Figure 55. Package outline SOT1021-1 (LFBGA324)
4
5
17.1
16.9
D
e
6
7
8
17.1
16.9
9
JEDEC
E
10
e
D
11
1
12
REFERENCES
0.8
13
e
1/2 e
14
15
NXP Semiconductors
0
15.2
16
e
1
17
18
b
19
15.2
JEITA
e 2
20
scale
5
0.15
1/2 e
v
B
e
∅ w
∅ v
e
A
E
0.08
2
w
M
M
10 mm
C
C
0.12
A
y
B
A
0.1
y
1
A
2
y
1
A
PROJECTION
1
EUROPEAN
C
detail X
32-Bit System-on-Chip
Preliminary data sheet
C
X
y
ISSUE DATE
07-07-07
07-07-07
SOT1021-1

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