MT47H256M4CF-3:H Micron Technology Inc, MT47H256M4CF-3:H Datasheet - Page 24

• Manufacturer Part Number: MT47H256M4CF-3:H
• Description: IC DDR2 SDRAM 1GBIT 60FBGA
• Manufacturer: Micron Technology Inc
• Series: -r

Specifications of MT47H256M4CF-3:H

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 1G (256M x 4)
• Speed: 3ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 60-TFBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table 6: Temperature Limits
Figure 11: Example Temperature Test Point Location
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Notes:
Test point
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 11. This case temperature limit is allowed to be exceeded briefly during pack-
age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering
Parameters.”
in Figure 11.
tion.
Lmm x Wmm FBGA
Width (W)
0.5 (W)
0.5 (L)
Length (L)
Electrical Specifications – Absolute Ratings
24
STG
Symbol
C
T
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package, as shown
T
T
T
T
T
STG
is measured in the center of the package, as shown
A
A
C
C
C
1Gb: x4, x8, x16 DDR2 SDRAM
Min
–55
–40
–40
–40
–40
0
Max
150
105
105
85
95
85
© 2004 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
C
during opera-
Notes
2, 3, 4
2, 3, 4
2, 3
4, 5
4, 5
1