HI9P0546-9Z96 Intersil, HI9P0546-9Z96 Datasheet - Page 20

• Manufacturer Part Number: HI9P0546-9Z96
• Description: IC MULTIPLEXER 16X1 28SOIC
• Manufacturer: Intersil

Specifications of HI9P0546-9Z96

• Function: Multiplexer
• Circuit: 1 x 16:1
• On-state Resistance: 1.8 kOhm
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±5 V ~ 18 V
• Current - Supply: 0.5mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.300", 7.50mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Plastic Leaded Chip Carrier Packages (PLCC)
0.020 (0.51) MAX
3 PLCS
NOTES:
0.042 (1.07)
0.048 (1.22)
1. Controlling dimension: INCH. Converted millimeter dimensions are
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
not necessarily exact.
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
PIN (1) IDENTIFIER
0.045 (1.14)
MIN
C L
D1
D
0.026 (0.66)
0.032 (0.81)
0.050 (1.27) TP
VIEW “A” TYP.
20
0.042 (1.07)
0.056 (1.42)
E1
-C-
E
C L
0.025 (0.64)
MIN
0.013 (0.33)
0.021 (0.53)
contact point.
HI-546, HI-547, HI-548, HI-549
A
A1
-C-
0.004 (0.10)
D2/E2
D2/E2
0.025 (0.64)
0.045 (1.14)
SEATING
PLANE
VIEW “A”
0.020 (0.51)
MIN
R
C
N28.45
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
A1
D1
D2
E1
E2
D
N
A
E
(JEDEC MS-018AB ISSUE A)
0.165
0.090
0.485
0.450
0.191
0.485
0.450
0.191
MIN
INCHES
28
MAX
0.180
0.120
0.495
0.456
0.219
0.495
0.456
0.219
12.32
11.43
12.32
11.43
MILLIMETERS
4.20
2.29
4.86
4.86
MIN
28
12.57
11.58
12.57
11.58
MAX
4.57
3.04
5.56
5.56
Rev. 2 11/97
NOTES
4, 5
4, 5
3
3
6
-
-
-
-