AM29DL164DT-120WCI Spansion Inc., AM29DL164DT-120WCI Datasheet - Page 56

• Manufacturer Part Number: AM29DL164DT-120WCI
• Manufacturer: Spansion Inc.

Specifications of AM29DL164DT-120WCI

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 120ns
• Interface Type: Parallel
• Boot Type: Top
• Address Bus: 21/20Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: FBGA
• Program/erase Volt (typ): 8.5 to 9.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 2M/1M
• Supply Current: 16mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

Revision D (February 22, 2000)
Global
The Am29DL16x family has migrated to a new 0.23
µm process technology, which is indicated by a “D” in
the ordering part number. All references in this docu-
ment have been changed to reflect the new process.
Distinctive Characteristics
Under “Performance Characteristics,” the typical accel-
erated programming time was changed to match the
AC tables.
AC Characteristics
Figure 17, Program Operations Timing; Figure 19,
Chip/Sector Erase Operations: Deleted t
changed OE# waveform to start at high.
Erase and Program Operations table; Alternate CE#
Controlled Erase and Program Operations table:
Changed the typical and maximum specifications for
programming time.
Erase and Programming Performance
In the table, changed the typical and maximum specifi-
cations for programming time. The typical and maxi-
mum chip programming times in both byte and word
modes are reduced.
Physical Dimensions
Replaced figures with more detailed illustrations.
Revision D+1 (June 21, 2000)
Global
Data sheet designation has changed from “Advance
Information” to “Preliminary.”
Deleted references to the 56-pin SSOP and the corre-
sponding 70R speed option.
Ordering Information
Added valid combinations for the Am29DL164D device
i n T S O P. A d d e d v a l i d c o m b i n a t i o n s fo r t h e
Am29DL162D devices in TSOP and FBGA packages.
D e l e t e d v a l i d c o m b i n a t i o n s fo r t h e 8 0 n s
Am29DL164D device in FBGA package.
Device Bus Operations
Table 3, Sector Addresses for Top Boot Sector De-
vices: In note below table, corrected last device part
number to top boot.
Table 7, Autoselect Codes: The Secured Silicon Sec-
tor Indicator Bit values have changed from 80h and
00h to 81h and 01h, respectively.
56
GHWL
D A T A
Am29DL16xD
and
S H E E T
Command Definitions
Table 14, Command Definitions: The Secured Silicon
Sector Indicator Bit values have changed from 80h
and 00h to 81h and 01h, respectively.
AC Characteristics
Read-only Operations table: Changed parameter t
16 ns for all speed options. Added Note 3.
Revision D+2 (September 4, 2000)
Deleted remaining references to 80 ns speed option,
which was officially removed in Revision D+1. Cor-
rected references to Am29DL16xC, which officially
changed to Am29DL16xD in Revision D.
Revision D+3 (November 22, 2000)
Global
Deleted Preliminary status from document. Added
table of contents.
Revision E (July 2, 2001)
Added Am29DL161D device to data sheet. Deleted
extended temperature range devices.
Sector/Sector Block Protection and Unprotection
Noted that sectors are unprotected in parallel.
Secured Silicon Sector Flash Memory Region
Noted changes for upcoming versions of these de-
vices: reduced Secured Silicon Sector size and dele-
tion of Secured Silicon Sector erase functionality.
Current versions of these devices remain unaffected.
Revision E+1 (July 29, 2002)
Global
Added 64-ball Fortified BGA package.
Command Definitions
Modified caution to state that incorrect command/se-
quences may place device in unknown state, upon
which device must be reset.
Unlock Bypass Command Sequence; Command
Definitions table
Corrected table and description to indicated that bank
address is not required for unlock bypass reset.
Package Capacitance
Added BGA capacitance specifications.
21533E6 February 26, 2009
DF
to