K6R4016V1D-UI10 Samsung Semiconductor, K6R4016V1D-UI10 Datasheet - Page 8

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K6R4016V1D-UI10

Manufacturer Part Number
K6R4016V1D-UI10
Description
Manufacturer
Samsung Semiconductor
Datasheet

Specifications of K6R4016V1D-UI10

Density
4Mb
Access Time (max)
10ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3.3V
Address Bus
18b
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Number Of Ports
1
Supply Current
75mA
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Word Size
16b
Number Of Words
256K
Lead Free Status / Rohs Status
Compliant

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K6R4016V1D
TIMING WAVEFORM OF WRITE CYCLE(1)
TIMING WAVEFORM OF WRITE CYCLE(2)
OE
Address
CS
UB, LB
WE
Data in
Data out
Address
CS
UB, LB
WE
Data in
Data out
NOTES(READ CYCLE)
1. WE is high for read cycle.
2. All read cycle timing is referenced from the last valid address to the first transition address.
3. t
4. At any given temperature and voltage condition, t
5. Transition is measured 200mV from steady state voltage with Load(B). This parameter is sampled and not 100% tested.
6. Device is continuously selected with CS=V
7. Address valid prior to coincident with CS transition low.
8. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycle.
levels.
device.
HZ
and t
OHZ
are defined as the time at which the outputs achieve the open circuit condition and are not referenced to V
High-Z
High-Z
t
t
AS(4)
AS(4)
(OE Clock)
(OE=Low fixed)
IL.
PRELIMPreliminaryPPPPPPPPPINARY
t
OHZ(6)
- 8 -
HZ
t
t
(Max.) is less than t
WHZ(6)
AW
t
CW(3)
t
t
t
AW
t
WC
WC
t
CW(3)
BW
t
BW
t
WP(2)
t
WP1(2)
LZ
t
High-Z
DW
(Min.) both for a given device and from device to
t
DW
Valid Data
Valid Data
t
WR(5)
t
WR(5)
t
DH
t
DH
t
OW
CMOS SRAM
High-Z
(10)
Mar. 2004
OH
Rev 4.0
(9)
or V
OL

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