IC AMP AUDIO PWR 1.2W MONO 8MSOP

TS4990IST

Manufacturer Part NumberTS4990IST
DescriptionIC AMP AUDIO PWR 1.2W MONO 8MSOP
ManufacturerSTMicroelectronics
TypeClass AB
TS4990IST datasheet
 


Specifications of TS4990IST

Output Type1-Channel (Mono)Max Output Power X Channels @ Load1.2W x 1 @ 8 Ohm
Voltage - Supply2.2 V ~ 5.5 VFeaturesDepop, Differential Inputs, Standby, Thermal Protection
Mounting TypeSurface MountPackage / Case8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
For Use With497-6383 - BOARD DEMO FOR TS4990Lead Free Status / RoHS StatusLead free / RoHS Compliant
Other names497-4451-2  
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TS4990
Figure 67. Package mechanical data for 9-bump flip-chip package
1.60 mm
1.60 mm
0.5mm
0.5mm
0.5mm
0.5mm
Figure 68. Daisy chain mechanical data
The daisy chain sample features two-by-two pin connections. The schematics in
illustrate the way pins connect to each other. This sample is used to test continuity on your
board. Your PCB needs to be designed the opposite way, so that pins that are unconnected
in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting
an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested.
Die size: 1.60 x 1.60 mm ±30µm
Die height (including bumps): 600µm
Bump diameter: 315µm ±50µm
Bump diameter before reflow: 300µm ±10µm
1.60 mm
1.60 mm
Bump height: 250µm ±40µm
Die height: 350µm ±20µm
Pitch: 500µm ±50µm
Coplanarity: 50µm max
∅ 0.25mm
∅ 0.25mm
* Back coating height: 100µm ±10µm
100µm
100µm
* Optional
600µm
600µm
1.6mm
1.6mm
3
3
2
2
1
1
B
B
C
C
A
A
Package information
1.6mm
1.6mm
Figure 68
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