TDA8933BTW/N2,518 NXP Semiconductors, TDA8933BTW/N2,518 Datasheet - Page 39

IC AMP AUDIO 20.6W STER 32TSSOP

TDA8933BTW/N2,518

Manufacturer Part Number
TDA8933BTW/N2,518
Description
IC AMP AUDIO 20.6W STER 32TSSOP
Manufacturer
NXP Semiconductors
Type
Class Dr
Datasheet

Specifications of TDA8933BTW/N2,518

Output Type
1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power X Channels @ Load
20.6W x 1 @ 16 Ohm; 10.3W x 2 @ 8 Ohm
Voltage - Supply
10 V ~ 36 V, ±5 V ~ 18 V
Features
Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Mounting Type
Surface Mount
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935285222518
TDA8933BTW/N2-T
TDA8933BTW/N2-T
NXP Semiconductors
15. Package outline
Fig 36. Package outline SOT549-1 (HTSSOP32)
TDA8933B_1
Preliminary data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 01 — 23 October 2008
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
EUROPEAN
detail X
0.2
v
L
Class D audio amplifier
L
0.1
p
w
TDA8933B
© NXP B.V. 2008. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
39 of 42
o
A

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