TS4990ID STMicroelectronics, TS4990ID Datasheet - Page 24

IC AMP AUDIO PWR 1.2W MON 8SOIC

TS4990ID

Manufacturer Part Number
TS4990ID
Description
IC AMP AUDIO PWR 1.2W MON 8SOIC
Manufacturer
STMicroelectronics
Type
Class ABr
Datasheet

Specifications of TS4990ID

Output Type
1-Channel (Mono)
Max Output Power X Channels @ Load
1.2W x 1 @ 8 Ohm
Voltage - Supply
2.2 V ~ 5.5 V
Features
Depop, Differential Inputs, Standby, Thermal Protection
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Operational Class
Class-AB
Audio Amplifier Output Configuration
1-Channel Mono
Output Power (typ)
1.2x1@8OhmW
Audio Amplifier Function
Speaker
Total Harmonic Distortion
0.2@8Ohm@1W%
Single Supply Voltage (typ)
3/5V
Dual Supply Voltage (typ)
Not RequiredV
Supply Current (max)
6@5VmA
Power Supply Requirement
Single
Unity Gain Bandwidth Product (typ)
1.5MHz
Rail/rail I/o Type
No
Power Supply Rejection Ratio
64dB
Single Supply Voltage (min)
2.2V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SO
For Use With
497-6383 - BOARD DEMO FOR TS4990
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TS4990ID
Manufacturer:
ST
0
Part Number:
TS4990IDT
Manufacturer:
EMC
Quantity:
21 000
Part Number:
TS4990IDT
Manufacturer:
ST
0
Part Number:
TS4990IDT
Manufacturer:
ST
Quantity:
20 000
Package information
5
5.1
24/32
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 65. Flip chip pinout (top view)
Figure 66. Marking (top view)
Flip-chip package information
®
packages. These packages have a lead-free second level interconnect. The
XXX
XXX
YWW
YWW
E
E
1
1
3
3
2
2
Symbol for
lead-free package
Balls are underneath
VOUT1
VOUT1
VOUT1
Vin+
Vin+
Vin+
Vin-
Vin-
Vin-
A
A
GND
GND
GND
GND
GND
GND
VCC
VCC
VCC
B
B
BYPASS
BYPASS
BYPASS
VOUT2
VOUT2
VOUT2
STBY
STBY
STBY
C
C
ST logo
Product and assembly code: XXX
A90 from Tours
90S from Shenzhen
Three-digit datecode: YWW
E symbol for lead-free only
The dot indicates pin A1
TS4990

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