TDA7501 STMicroelectronics, TDA7501 Datasheet - Page 27
TDA7501
Manufacturer Part Number
TDA7501
Description
IC PROCESSOR DSPLD CAR 44-LQFP
Manufacturer
STMicroelectronics
Type
Car Signal Processorr
Datasheet
1.TDA7501.pdf
(29 pages)
Specifications of TDA7501
Applications
Automotive Systems
Mounting Type
Surface Mount
Package / Case
44-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
TDA7501
10
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 17. LQFP44 (10x10) mechanical data & package dimensions
DIM.
ccc
A1
A2
D1
D3
E1
E3
L1
A
B
C
D
E
e
L
k
11.80
11.80
MIN.
0.05
1.35
0.30
0.09
9.80
9.80
0.45
12.00
10.00
12.00
10.00
TYP.
1.40
0.37
8.00
8.00
0.80
0.60
1.00
mm
0˚(min.), 3.5˚(typ.), 7˚(max.)
MAX.
12.20
10.20
12.20
10.20
1.60
0.15
1.45
0.45
0.20
0.75
0.10
0.002
0.053
0.012
0.004
0.464
0.386
0.464
0.386
0.018
MIN.
0.055
0.015
0.472
0.394
0.315
0.472
0.394
0.315
0.031
0.024
0.039
TYP.
inch
0.0039
MAX.
0.063
0.006
0.057
0.018
0.008
0.480
0.401
0.480
0.401
0.030
LQFP44 (10 x 10 x 1.4mm)
MECHANICAL DATA
OUTLINE AND
Package information
0076922 E
27/29