SA58635 NXP Semiconductors, SA58635 Datasheet - Page 24

• Manufacturer Part Number: SA58635
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Package outline
Fig 26. Package outline SA58635UK (WLCSP16)
SA58635_1
Product data sheet
WLCSP16: wafer level chip-size package; 16 balls; 1.7 x 1.7 x 0.56 mm
Dimensions
mm
SA58635UK
Unit
Outline
version
max
nom
min
ball A1
index area
ball A1
index area
0.615
0.560
0.505
A
0.23
0.20
0.17
A
D
C
B
A
1
0.385
0.360
0.335
A
IEC
2
1
0.29
0.26
0.23
b
e
1.725
1.695
1.665
2
D
e
D
1.725
1.695
1.665
1
JEDEC
E
3
b
0.4
e
References
Rev. 01 — 26 March 2010
1.2
e
4
1
0
1.2
e
2
JEITA
B
e
0.02
scale
0.5
v
w
v
e
A
E
2
0.01
w
C
C
A
0.03
B
y
1 mm
2 × 25 mW class-G stereo headphone driver
A
A
2
A
1
detail X
European
projection
X
y
SA58635
© NXP B.V. 2010. All rights reserved.
Issue date
10-01-18
10-01-19
sa58635uk_po
SA58635UK
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