SA58670 NXP Semiconductors, SA58670 Datasheet - Page 19

• Manufacturer Part Number: SA58670
• Manufacturer: NXP Semiconductors

NXP Semiconductors
12. Package outline
Fig 17. Package outline SOT917-1 (HVQFN20)
SA58670_3
Product data sheet
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 4 x 4 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
SOT917 -1
OUTLINE
VERSION
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
5
1
b
IEC
- - -
0.2
c
6
20
e
D
4.1
3.9
(1)
e 1
D h
D
2.45
2.15
b
D h
MO-220
JEDEC
16
0
10
E
4.1
3.9
(1)
REFERENCES
Rev. 03 — 11 June 2009
2.45
2.15
E h
11
15
B
e
0.5
e 2
A
E
e
JEITA
scale
w
v
2.5
- - -
M
M
e 1
2
C
C
A
e 2
B
2
2.1 W/channel stereo class-D audio amplifier
A
0.6
0.4
L
5 mm
A 1
0.1
y 1 C
v
0.05
w
detail X
PROJECTION
EUROPEAN
0.05
y
0.1
y 1
C
X
y
SA58670
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
c
05-10-08
05-10-31
SOT917-1
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