SA58670 NXP Semiconductors, SA58670 Datasheet - Page 22
SA58670
Manufacturer Part Number
SA58670
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SA58670.pdf
(25 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SA58670BS
Manufacturer:
PHILIPS
Quantity:
1 831
NXP Semiconductors
14. Abbreviations
SA58670_3
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 9.
Acronym
DAP
DVD
EMI
ESR
LC
PC
PCB
PDA
PWM
USB
Fig 18. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Die Attach Paddle
Digital Video Disc
ElectroMagnetic Interference
Equivalent Series Resistance
inductor-capacitor filter
Personal Computer
Printed-Circuit Board
Personal Digital Assistant
Pulse Width Modulator
Universal Serial Bus
Rev. 03 — 11 June 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
2.1 W/channel stereo class-D audio amplifier
temperature
peak
SA58670
© NXP B.V. 2009. All rights reserved.
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