BAV99_SER NXP Semiconductors, BAV99_SER Datasheet - Page 4

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BAV99_SER

Manufacturer Part Number
BAV99_SER
Description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
6. Thermal characteristics
7. Characteristics
BAV99_SER
Product data sheet
Table 7.
[1]
[2]
[3]
Table 8.
T
[1]
[2]
Symbol
R
R
Symbol
Per diode
V
I
C
t
V
R
rr
amb
F
FR
th(j-a)
th(j-sp)
d
Single diode loaded.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Soldering points at pins 2, 3, 5 and 6.
When switched from I
When switched from I
= 25
°
C unless otherwise specified.
Parameter
forward voltage
reverse current
diode capacitance
reverse recovery time
forward recovery voltage
Thermal characteristics
Characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
BAV99
BAV99W
BAV99
BAV99S
BAV99W
All information provided in this document is subject to legal disclaimers.
F
F
Rev. 8 — 18 November 2010
= 10 mA to I
= 10 mA; t
r
= 20 ns.
R
= 10 mA; R
I
f = 1 MHz; V
Conditions
I
I
I
V
V
V
V
F
F
F
F
R
R
R
R
= 1 mA
= 10 mA
= 50 mA
= 150 mA
= 25 V
= 80 V
= 25 V; T
= 80 V; T
Conditions
in free air
L
= 100 Ω; measured at I
j
j
R
= 150 °C
= 150 °C
= 0 V
[1][2]
High-speed switching diodes
[3]
[1]
[2]
BAV99 series
Min
-
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
-
R
= 1 mA.
Typ
-
-
-
-
-
Typ
-
-
-
-
-
-
-
-
-
-
-
© NXP B.V. 2010. All rights reserved.
Max
500
625
360
260
300
Max
715
855
1
1.25
30
0.5
30
50
1.5
4
1.75
Unit
K/W
K/W
K/W
K/W
K/W
Unit
mV
mV
V
V
nA
μA
μA
μA
pF
ns
V
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