BSS138PS NXP Semiconductors, BSS138PS Datasheet - Page 12

• Manufacturer Part Number: BSS138PS
• Description: Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
BSS138PS
Product data sheet
Fig 19. Reflow soldering footprint SOT363 (SC-88)
Fig 20. Wave soldering footprint SOT363 (SC-88)
4.5
2.35
1.5
All information provided in this document is subject to legal disclaimers.
1.3
(4×)
0.6
(4×)
0.5
Rev. 1 — 2 November 2010
2.45
5.3
(4×)
(4×)
0.5
0.6
1.3
2.65
1.8
(2×)
0.6
60 V, 320 mA dual N-channel Trench MOSFET
1.5
1.5
0.4 (2×)
0.3
2.5
Dimensions in mm
BSS138PS
direction during soldering
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
preferred transport
sot363_fr
solder lands
solder resist
occupied area
sot363_fw
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