TS507 STMicroelectronics, TS507 Datasheet - Page 17

• Manufacturer Part Number: TS507
• Description: High precision single supply rail to rail op-amp
• Manufacturer: STMicroelectronics

Specifications of TS507

• Ultra Low Offset Voltage: 25μV typ, 100μV max
• High Speed: 1.9MHz
• Low Consumption: 0.8mA at 2.7V
• Very Large Signal Voltage Gain: 131dB
• High Power Supply Rejection Ratio: 105dB

TS507
4
4.1
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
SOT23-5 package information
Figure 31. SOT23-5 package mechanical drawing
Table 7.
Ref.
A1
A2
E1
e1
A
C
D
E
b
e
L
®
packages. These packages have a lead-free second level interconnect. The
SOT23-5 package mechanical data
Min.
0.90
0.00
0.90
0.35
0.09
2.80
2.60
1.50
0.35
Millimeters
Typ.
0.95
1.9
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
0.55
Dimensions
110.2
102.3
Min.
35.4
0.00
35.4
13.7
59.0
13.7
3.5
Package information
Typ.
Mils
37.4
74.8
118.1
118.1
Max.
57.1
51.2
19.7
68.8
21.6
5.9
7.8
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