BU508AX NXP Semiconductors, BU508AX Datasheet
BU508AX
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BU508AX Summary of contents
Page 1
... T 25 ˚ 4 1 kHz 16kHz Csat PIN CONFIGURATION case CONDITIONS ˚C hs CONDITIONS without heatsink compound with heatsink compound in free air 1 Product specification BU508AX TYP. MAX. UNIT - 1500 V - 700 1 SYMBOL ...
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... 100 mA CONDITIONS I = 0.1 A 4.5 A;L 1 mH;C Csat 1 B(end 2. Product specification BU508AX MIN. TYP. MAX. - 2500 - 22 - MIN. TYP. MAX 1 2 700 - - - - 1 1 TYP. MAX 125 - = ...
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... VCEOsust . CEOsust ICsat h FE 100 t IBend 0.1 t Fig.6. Typical DC current gain Product specification BU508AX ICsat IBend - IBM Fig.4. Switching times definitions. + 150 v nominal adjust for ICsat 1mH LB D.U.T. 12nF Fig.5. Switching times test circuit . BU508AD ...
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... Fig.11. Normalised power dissipation. C BU508AD 4. Product specification BU508AX bu508ax 1.0E-05 1E-03 1.0E-01 1.0E f(t); parameter j-hs p Normalised Power Derating with heatsink compound ...
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... VCE / V = 25˚C Fig.13. Forward bias safe operating area Region of permissible DC operation. II Extension for repetitive pulse operation. NB: Mounted without heatsink compound and 30 the envelope. 5 Product specification BU508AX 0.01 ICM max IC max II Ptot max I 1000 1 10 100 VCE / V 5 newton force on the centre of ...
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... Net Mass: 5.88 g 4.5 27 max 22.5 max 18.1 min Fig.14. SOT399; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". July 1998 16.0 max 0.7 10.0 25.1 25.7 5.1 2.2 max 4.5 1.1 0.4 M 5.45 5.45 6 Product specification BU508AX 5.8 max 3.0 3 0.95 max 3.3 Rev 1.200 ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1998 7 Product specification BU508AX Rev 1.200 ...