BF869 NXP Semiconductors, BF869 Datasheet - Page 4

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BF869

Manufacturer Part Number
BF869
Description
Npn High-voltage Transistors
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
PACKAGE OUTLINE
1999 Apr 12
Plastic single-ended leaded (through hole) package; with cooling fin, mountable to heatsink,
1 mounting hole; 3 leads (in-line)
NPN high-voltage transistors
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic flash allowed within this zone
UNIT
mm
VERSION
OUTLINE
SOT128B
4.6
4.4
A
0.8
0.6
b p
0.65
0.5
c
IEC
0.56
0.46
c 1
L 2
8.6
8.4
D
TO-202
JEDEC
1
10.1
9.9
E
E 1
E
e
P
b p
REFERENCES
2
e 1
10.4
10.0
E
1
0
3
5.08
w
L 1
e
P 1
scale
M
EIAJ
4
H E
5
2.54
e 1
10 mm
24.2
23.8
H E
13.3
12.2
Q
L
c
A
1
c
2.4
2.0
L 1
D
L
L 2
PROJECTION
max
2.5
EUROPEAN
(1)
3.8
3.6
P
BF869; BF871
Product specification
3.9
3.7
P 1
ISSUE DATE
97-02-28
1.7
1.5
Q
SOT128B
0.25
w

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