NBB-302 RF Micro Devices, NBB-302 Datasheet - Page 4

• Manufacturer Part Number: NBB-302
• Description: Cascadable Broadband Gaas Mmic Amplifier Dc To 12 Ghz Nbb-302
• Manufacturer: RF Micro Devices

NBB-302
Die Attach
The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically connects the ground to
the trace on which the chip is mounted, and establishes the thermal path by which heat can leave the chip.
Wire Bonding
Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are acceptable prac-
tices for wire bonding.
Assembly Procedure
Epoxy or eutectic die attach are both acceptable attachment methods. Top and bottom metallization are gold. Conductive sil-
ver-filled epoxies are recommended. This procedure involves the use of epoxy to form a joint between the backside gold of the
chip and the metallized area of the substrate. A 150°C cure for 1 hour is necessary. Recommended epoxy is Ablebond 84-
1LMI from Ablestik.
Bonding Temperature (Wedge or Ball)
It is recommended that the heater block temperature be set to 160°C±10°C.
4 of 8
Recommended Bias Resistor Values
Supply Voltage, V
Bias Resistor, R
Application notes related to biasing circuit, device footprint, and thermal considerations are available on request.
CC
CC
(Ω)
(V)
22
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
5
In
Typical Bias Configuration
81
8
C block
Application Notes
4
122
10
5,6,7,9
1,2,3
8
162
12
V
DEVICE
V
L choke
(optional)
V
CC
R
C block
D
CC
= 3.9 V
222
15
Out
322
20
Rev A6 DS060124