ACS374DMSR Intersil Corporation, ACS374DMSR Datasheet - Page 8

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ACS374DMSR

Manufacturer Part Number
ACS374DMSR
Description
Radiation Hardened Octal D Flip-Flop, Three-state
Manufacturer
Intersil Corporation
Datasheet
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
Metallization Mask Layout
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
102 mils x 102 mils
2,600mm x 2,600mm
Type: AlSiCu
Metal 1 Thickness: 6.75k
Metal 2 Thickness: 9k
Type: SiO
Thickness: 8k
2
Q1 (5)
Q2 (6)
D1 (4)
D2 (7)
Å
NC
NC
1k
Å
Å
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(Min), 11k
Å
(Min), 8.25k
Å
(Max)
Å
D0
(8)
D3
(3)
(Max)
Q0
Q3
(2)
(9)
ACS374MS
GND
(10)
OE
ACS374MS
(1)
8
VCC
(20)
(11)
DIE ATTACH:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
CP
Material: Silver Glass or JM 7000 after 7/1/95
< 2.0 x 10
> 4.3 mils x 4.3 mils
> 110 m x 110 m
(19)
(12)
Q7
Q4
5
(18)
(13)
A/cm
D7
D4
2
Spec Number
(17) D6
(16) Q6
NC
NC
(15) Q5
(14) D5
518820

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