MD18R3268AG0 Samsung Semiconductor, Inc., MD18R3268AG0 Datasheet - Page 2

• Manufacturer Part Number: MD18R3268AG0
• Description: Description = MD18R3268AG0 (32Mx18)x8(16)pcs RIMM(TM) Module Based on 576Mb A-die, 32s Banks,32K/32ms Ref, 2.5V ;; Density(MB) = 512 ;; Organization = 128Mx36 ;; Component Composition = 576M(2th)x8 ;; Voltage(V) = 2.5 ;; Refresh = 32K/32ms ;; Speed(M
• Manufacturer: Samsung Semiconductor, Inc.

MD18R3268(G)AG0
(32Mx18)*8(16)pcs RIMM
Overview
The 32 bit RIMM
mance line of memory modules suitable for use in a broad
range of applications including computer memory, personal
computers, workstations, and other applications where high
bandwidth and low latency are required.
The 32 bit RIMM module consists of 576Mb RDRAM
devices. These are extremely high-speed CMOS DRAMs
organized as 32M words by 18 bits. The use of Rambus
Signaling Level (RSL) technology permits the use of
conventional system and board design technologies. RIMM
3200 modules support 800MHz transfer rate per pin,
resulting in total module bandwidth of 3200MB/s or
3.2GB/s. RIMM 4200 modules support 1066MHz transfer
rate per pin, resulting in total module bandwidth of
4200MB/s or 4.2GB/s. RIMM 4800 modules support
1200MHz transfer rate per pin, resulting in total module
bandwidth of 4800MB/s or 4.8GB/s.
The 32 bit RIMM module provides two independent 18 bit
memory channels to facilitate compact system design. The
"Thru" Channel enters and exits the module to support a
connection to or from a controller, memory slot, or termina-
tion. The "Term" Channel is terminated on the module and
supports a connection from a controller or another memory
slot.
The RDRAM architecture enables the highest sustained
bandwidth for multiple, simultaneous, randomly addressed
memory transactions. The separate control and data buses
with independent row and column control yield over 95%
bus efficiency. The RDRAM device multi-bank architecture
supports up to four simultaneous transactions per device.
Features
♦
♦
♦
♦
♦
♦ Gold plated edge connector pad contacts
♦ Serial Presence Detect (SPD) support
terminated on 32 bit RIMM module
(5.25” x 1.375” x 0.05”)
each 1152MB, 576MB module respectively
2 Independent RDRAM channels, 1 pass through and 1
High speed 800, 1066 and 1200MHz RDRAM devices
232 edge connector pads with 1mm pad spacing
Module PCB size: 133.35mm x 34.93mm x 1.27mm
Each RDRAM has 32 banks, for a total of 512, 256 banks on
®
module is a general purpose high-perfor-
Note: On double sided modules, RDRAMs are also installed on bottom side of PCB.
TM
Figure 1 : 32 bit RIMM module with heat spreader removed
Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V
®
Page 1
♦ Operates from a 2.5 volt supply (±5%)
♦ Low power and powerdown self refresh modes
♦ Separate Row and Column buses for higher efficiency
♦ WBGA lead free package (92 balls)
Key Timing Parameters
The following table lists the frequency and latency bins
available for 32 bit RIMM modules.
Form Factor
The 32 bit RIMM modules are offered in 232-pad 1mm edge
connector pad pitch suitable for 232 contact RIMM connec-
tors. Figure 1 below, shows a sixteen device 32 bit RIMM
module.
Table 1: 32 bit RIMM Module Frequency and Latency
RIMM 4800
RIMM 4200
RIMM 3200
Organi-
128Mx36 1200MHz
256Mx36
128Mx36 1066MHz
256Mx36
128Mx36 800MHz
256Mx36
zation
32 Bit RIMM
I/O Freq.
(MHz)
Version 0.1 Sept. 2003
Speed
Access
Time)
(Row
t
32P
RAC
ns
32
40
Preliminary
MD18R326GAG0-CM8
MD18R326GAG0-CN1
MD18R3268AG0-CM8
MD18R326GAG0-CT9
MD18R3268AG0-CN1
MD18R3268AG0-CT9
Part Number
®
Module