SST89V58RD Silicon Storage Technology, SST89V58RD Datasheet - Page 80

• Manufacturer Part Number: SST89V58RD
• Description: FlashFlex51 MCU
• Manufacturer: Silicon Storage Technology

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Data Sheet
©2006 Silicon Storage Technology, Inc.
Note:
Pin #1 Identifier
FIGURE 16-3: 44-lead Thin Quad Flat Pack (TQFP)
FIGURE 16-4: 40-contact Very-very-thin Quad Flat No-lead (WQFN)
Pin #1
Note: 1. Complies with JEDEC JEP95 MO-220I, variant WJJD-5 except external paddle nominal dimensions.
max.
1.2
2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.
3. The external paddle is electrically connected to the die back-side and possibly to certain V
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
1. Complies with JEDEC publication 95 MS-026 ACB dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±0.05) mm.
4. Package body dimensions do not include mold flash. Maximum allowable mold flash is .25mm.
This paddle should be soldered to the PC board; it is suggested to connect this paddle to the V
Connection of this paddle to any other voltage potential will result in shorts and/or electrical malfunction of the device.
11
1
12
44
SST Package Code: TQJ
SST Package Code: QI
TOP VIEW
6.00 ± 0.10
10.00 ± 0.10
12.00 ± 0.25
SST89E52RD2/RD / SST89E54RD2/RD / SST89E58RD2/RD
SST89V52RD2/RD / SST89V54RD2/RD / SST89V58RD2/RD
34
22
6.00 ± 0.10
33
23
10.00 ± 0.10
SIDE VIEW
0.80
0.70
12.00 ± 0.25
80
0.05 Max
0.2
0.075
.09
.20
.30
.45
SS
1.05
.80 BSC
.95
leads.
SS
BOTTOM VIEW
4.1
of the unit.
4.1
.05
.15
FlashFlex51 MCU
40-wqfn-6x6-QI-1
1.00 ref
S71255-05-000
.45
.75
1mm
44-tqfp-TQJ-7
See notes
2 and 3
1mm
0.5 BSC
Pin #1
0.45
0.35
0.30
0.18
0˚- 7˚
5/06