IDT72V2113L7-5PF IDT, Integrated Device Technology Inc, IDT72V2113L7-5PF Datasheet - Page 26

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IDT72V2113L7-5PF

Manufacturer Part Number
IDT72V2113L7-5PF
Description
IC FIFO SUPERSYNCII 7-5NS 80TQFP
Manufacturer
IDT, Integrated Device Technology Inc
Series
72Vr
Datasheet

Specifications of IDT72V2113L7-5PF

Function
Synchronous
Memory Size
4.7Mb (262k x 18)
Access Time
5ns
Voltage - Supply
3.15 V ~ 3.45 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
80-TQFP, 80-VQFP
Configuration
Dual
Density
4.5Mb
Access Time (max)
5ns
Word Size
18/9Bit
Organization
256Kx18/512Kx9
Sync/async
Synchronous
Expandable
Yes
Bus Direction
Uni-Directional
Package Type
TQFP
Clock Freq (max)
133.3MHz
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.15V
Operating Supply Voltage (max)
3.45V
Supply Current
35mA
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
80
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Data Rate
-
Lead Free Status / Rohs Status
Not Compliant
Other names
72V2113L7-5PF

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDT72V2113L7-5PF
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Part Number:
IDT72V2113L7-5PF8
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Q
D
NOTES:
1. t
2. LD = HIGH.
3. First data word latency: t
NOTES:
1. t
2. LD = HIGH, EF = HIGH
IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II
IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC II
8K x 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9
131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9
D
Q
WCLK
RCLK
0
0
WEN
WCLK
REN
0
0
RCLK
- Q
- D
of WCLK and the rising edge of RCLK is less than t
of the RCLK and the rising edge of the WCLK is less than t
SKEW1
WEN
SKEW1
OE
REN
EF
- D
- Q
FF
n
n
n
n
is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus t
t
is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go high (after one WCLK cycle pus t
ENS
DATA IN OUTPUT REGISTER
t
ENS
t
SKEW1
t
t
OLZ
ENH
SKEW1
t
REF
t
A
Figure 8. Read Cycle, Empty Flag and First Data Word Latency Timing (IDT Standard Mode)
t
OE
(1)
+ 1*T
t
SKEW1
RCLK
t
t
ENS
ENH
t
DS
t
A
+ t
D
(1)
1
0
REF
NO WRITE
NO OPERATION
Figure 7. Write Cycle and Full Flag Timing (IDT Standard Mode)
.
t
t
DHS
ENH
SKEW1
LAST WORD
1
, then EF deassertion may be delayed one extra RCLK cycle.
SKEW1
2
t
, then the FF deassertion may be delayed one extra WCLK cycle.
WFF
TM
t
t
OHZ
DS
t
NARROW BUS FIFO
t
DS
ENS
D
DX
1
NO OPERATION
TM
t
CLKH
t
WFF
NARROW BUS FIFO
t
t
ENH
DH
DATA READ
26
t
t
DH
CLK
2
t
CLKL
t
CLKH
t
t
REF
ENS
t
OLZ
t
SKEW1
t
CLK
(1)
t
CLKL
t
ENS
t
ENH
LAST WORD
t
A
1
NO WRITE
t
ENH
t
A
COMMERCIAL AND INDUSTRIAL
WFF
REF
2
t
WFF
). If the time between the rising edge
). If the time between the rising edge
TEMPERATURE RANGES
t
ENS
t
DS
NEXT DATA READ
D
0
DX+1
JUNE 1, 2010
t
WFF
t
REF
t
t
ENH
A
6119 drw10
t
DH
6119 drw11
D
1

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