IDT72V2113L7-5PF IDT, Integrated Device Technology Inc, IDT72V2113L7-5PF Datasheet - Page 33

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IDT72V2113L7-5PF

Manufacturer Part Number
IDT72V2113L7-5PF
Description
IC FIFO SUPERSYNCII 7-5NS 80TQFP
Manufacturer
IDT, Integrated Device Technology Inc
Series
72Vr
Datasheet

Specifications of IDT72V2113L7-5PF

Function
Synchronous
Memory Size
4.7Mb (262k x 18)
Access Time
5ns
Voltage - Supply
3.15 V ~ 3.45 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
80-TQFP, 80-VQFP
Configuration
Dual
Density
4.5Mb
Access Time (max)
5ns
Word Size
18/9Bit
Organization
256Kx18/512Kx9
Sync/async
Synchronous
Expandable
Yes
Bus Direction
Uni-Directional
Package Type
TQFP
Clock Freq (max)
133.3MHz
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.15V
Operating Supply Voltage (max)
3.45V
Supply Current
35mA
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
80
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Data Rate
-
Lead Free Status / Rohs Status
Not Compliant
Other names
72V2113L7-5PF

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDT72V2113L7-5PF
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Part Number:
IDT72V2113L7-5PF8
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
NOTE:
1. This diagram is based on programming the IDT72V2103/72V2113 x18 bus width. Add one extra cycle to both the PAE offset and PAF offset for x9 bus width.
NOTES:
1. OE = LOW.
2. This diagram is based on programming the IDT72V2103/72V2113 x18 bus width. Add one extra cycle to both the PAE offset and PAF offset for x9 bus width.
NOTES:
1. m = PAF offset .
2. D = maximum FIFO depth.
3. t
4. PAF is asserted and updated on the rising edge of WCLK only.
5. Select this mode by setting PFM HIGH during Master Reset.
IDT72V263/273/283/293/103/113 3.3V HIGH DENSITY SUPERSYNC II
8K x 18, 16K x 9/18, 32K x 9/18, 64K x 9/18, 128K x 9/18, 256K x 9/18, 512K x9
IDT72V2103/72V2113 3.3V HIGH DENSITY SUPERSYNC II
131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9
D
Q
WCLK
RCLK
WEN
In IDT Standard mode: if x18 Input or x18 Output bus Width is selected, D = 131,072 for the IDT72V2103 and 262,144 for the IDT72V2113. If both x9 Input and x9 Output bus Widths
are selected, D = 262,144 for the IDT72V2103 and 524,288 for the IDT72V2113.
In FWFT mode: if x18 Input or x18 Output bus Width is selected, D = 131,073 for the IDT72V2103 and 262,145 for the IDT72V2113. If both x9 Input and x9 Output bus Widths
are selected, D = 262,145 for the IDT72V2103 and 524,289 for the IDT72V2113.
rising edge of RCLK and the rising edge of WCLK is less than t
0
REN
WCLK
0
PAF
SKEW2
RCLK
- D
WEN
- Q
REN
LD
16
LD
16
is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH (after one WCLK cycle plus t
DATA IN OUTPUT
t
CLKH
REGISTER
Figure 18. Synchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)
Figure 16. Parallel Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)
t
t
ENS
LDS
Figure 17. Parallel Read of Programmable Flag Registers (IDT Standard and FWFT Modes)
t
ENS
t
CLKL
t
CLKH
D-(m+1) words in FIFO
PAE OFFSET (LSB)
t
t
CLK
ENH
t
CLKH
t
t
A
t
LDH
t
t
ENS
t
ENH
LDS
t
CLKL
DS
t
CLK
1
t
( 2)
CLKL
PAE OFFSET
SKEW2
TM
(LSB)
t
t
t
ENH
LDH
DH
PAE OFFSET (MSB)
NARROW BUS FIFO
, then the PAF deassertion time may be delayed one extra WCLK cycle.
t
A
2
TM
t
DS
t
PAFS
33
NARROW BUS FIFO
PAE OFFSET
t
ENS
(MSB)
t
SKEW2
t
PAF OFFSET (LSB)
DH
(3)
t
A
t
t
DS
D - m words in FIFO
ENH
1
PAF OFFSET
(LSB)
PAF OFFSET (MSB)
t
COMMERCIAL AND INDUSTRIAL
DH
(2)
t
A
t
t
LDH
ENH
2
TEMPERATURE RANGES
t
PAFS
t
DS
PAFS
). If the time between the
PAF OFFSET
JUNE 1, 2010
(MSB)
D-(m+1) words
in FIFO
6119 drw19
6119 drw21
6119 drw20
t
t
t
ENH
DH
LDH
( 2)

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