D63711 NEC, D63711 Datasheet - Page 59

• Manufacturer Part Number: D63711
• Description: Search -----> UPD63711
• Manufacturer: NEC

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5. RECOMMENDED SOLDERING CONDITIONS
Mounting Technology Manual (C10535E).
representative.
PD63711GC-8EU: 100-pin plastic LQFP (fine pitch) (14
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
The PD63711 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
For soldering methods and conditions other than those recommended below, contact your NEC sales
Note
Caution Do not use different soldering methods together (except for partial heating).
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher),
Count: two times or less, Exposure limit: 3 days
for 10 hours)
Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher),
Count: two times or less
Solder bath temperature: 260°C Max., Time: 10 sec. Max., Count: once,
Preheating temperature: 120°C Max. (package surface temperature)
Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)
Table 5-1. Surface Mounting Type Soldering Conditions
Preliminary Product Information S14470EJ1V1PM00
Soldering Conditions
14 mm)
Note
(after that, prebake at 125°C
Condition Symbol
Recommended
IR35-103-2
WS60-00-1
PD63711
VP15-00-2
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