LTC2274 Linear Technology, LTC2274 Datasheet - Page 39

• Manufacturer Part Number: LTC2274
• Description: 105Msps Serial Output ADC
• Manufacturer: Linear Technology

www.datasheet4u.com
PACKAGE DESCRIPTION
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
PIN 1 TOP MARK
(SEE NOTE 6)
4.42 0.05
6.00 0.10
(4 SIDES)
4.42 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
0.25 0.05
(Reference LTC DWG # 05-08-1728 Rev Ø)
40-Lead Plastic QFN (6mm × 6mm)
0.70 0.05
4.50 0.05
PACKAGE OUTLINE
(4 SIDES)
0.75 0.05
UJ Package
5.10 0.05
(4-SIDES)
4.50 REF
0.200 REF
0.00 – 0.05
R = 0.10
6.50 0.05
TYP
R = 0.115
4.42 0.10
BOTTOM VIEW—EXPOSED PAD
TYP
PIN 1 NOTCH
R = 0.45 OR
4.42 0.10
0.35 45
CHAMFER
39
0.50 BSC
0.25 0.05
40
LTC2274
(UJ40) QFN REV Ø 0406
0.40 0.10
1
2
39
2274f