mt47h128m16hg-3-it Micron Semiconductor Products, mt47h128m16hg-3-it Datasheet - Page 123

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mt47h128m16hg-3-it

Manufacturer Part Number
mt47h128m16hg-3-it
Description
2gb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet
PDF: 09005aef824f87b6/Source: 09005aef824f1182
2gb_ddr2.fm - Rev. A 9/06 EN
11. The intent of the “Don’t Care” state after completion of the postamble is that the DQS-
12. This is not a device limit. The device will operate with a negative value, but system
13. It is recommended that DQS be valid (HIGH or LOW) on or before the WRITE com-
14. The refresh period is 64ms (commercial) or 32ms (industrial). This equates to an aver-
15. Referenced to each output group: x4 = DQS with DQ0–DQ3; x8 = DQS with DQ0–DQ7;
16. CK and CK# input slew rate is referenced at 1 V/ns (2 V/ns if measured differentially).
17. The data valid window is derived by achieving other specifications:
18. READs and WRITEs with auto precharge are allowed to be issued before
19. V
20.
21. The minimum internal READ to PRECHARGE time. This is the time from the last 4-bit
22. Operating frequency is only allowed to change during self refresh mode (see Figure 56
23. ODT turn-on time
24. ODT turn-off time
25. This parameter has a two clock minimum requirement at any
driven signal should either be HIGH, LOW, or High-Z, and that any signal transition
within the input switching region must follow valid input requirements. That is, if
DQS transitions HIGH (above V
V
performance could be degraded due to bus turnaround.
mand. The case shown (DQS going from High-Z to logic LOW) applies when no
WRITEs were previously in progress on the bus. If a previous WRITE was in progress,
DQS could be HIGH during this time, depending on
age refresh rate of 7.8125µs (commercial) or 3.9607µs (industrial). However, a
REFRESH command must be asserted at least once every 70.3µs (commercial) or
35.150µs (industrial) or
refreshed, 8,192 REFRESH commands must be issued every 64ms (commercial) or
32ms (industrial).
x16 = LDQS with DQ0–DQ7; and UDQS with DQ8–DQ15.
t
tion to the clock duty cycle and a practical data valid window can be derived.
satisfied since
on page 105.
t
rounded up to the next integer.
to the
with
(4) clocks = 8 clocks.
prefetch begins to when the PRECHARGE command can be issued. A 4-bit prefetch is
when the READ command internally latches the READ so that data will output CL
later. This parameter is only applicable when
faster than 533 MHz when
2 applies.
ically delay the internal PRECHARGE command until
on page 71), precharge power-down mode, or system reset condition (See “Reset
Function” on page 72). SSC allows for small deviations in operating frequency, pro-
vided the SSC guidelines are satisfied.
begins to turn on. ODT turn-on time
on. Both are measured from
ODT turn off time
t
DQSQ, and
DAL = (nWR) + (
AOFD.
IH
IL
/V
[
DC
t
IH
WR programmed to four clocks would have
t
]) prior to
WR parameter stored in the MR[11, 10, 9]. For example, -37E at
DDR2 overshoot/undershoot. See “AC Overshoot/Undershoot Specification”
t
RAS (MIN) also has to be satisfied as well. The DDR2 SDRAM will automat-
t
QH (
t
RAS lockout feature is supported in DDR2 SDRAM.
t
t
RP/
DQSH (MIN).
t
QH =
t
t
t
AOF (MAX) is when the bus is in High-Z. Both are measured from
AON (MIN) is when the device leaves High-Z and ODT resistance
AOF (MIN) is when the device starts to turn off ODT resistance.
t
CK). Each of these terms, if not already an integer, should be
t
t
RFC (MAX). To ensure all rows of all banks are properly
HP -
123
t
RTP = 7.5ns. If
t
AOND.
t
QHS). The data valid window derates in direct propor-
IH
t
CK refers to the application clock period; nWR refers
[
DC
Micron Technology, Inc., reserves the right to change products or specifications without notice.
] MIN), then it must not transition LOW (below
t
AON (MAX) is when the ODT resistance is fully
t
RTP / (2 x
2Gb: x4, x8, x16 DDR2 SDRAM
t
RTP / (2 x
t
DAL = 4 + (15ns/3.75ns) clocks = 4 +
t
t
DQSS.
CK) ≤ 1, then equation AL + BL/
t
RAS (MIN) has been satisfied.
t
CK) > 1, such as frequencies
©2006 Micron Technology, Inc. All rights reserved.
t
CK.
t
HP (
t
CK = 3.75ns
t
RAS (MIN) is
t
CK/2),
Notes

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