xa2c32a Xilinx Corp., xa2c32a Datasheet - Page 12

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xa2c32a

Manufacturer Part Number
xa2c32a
Description
Coolrunner-ii Automotive Cpld Product Family
Manufacturer
Xilinx Corp.
Datasheet

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CoolRunner-II Automotive CPLD Product Family
Absolute Maximum Ratings
CoolRunner-II Automotive Data Sheets
http://direct.xilinx.com/bvdocs/publications/ds552.pdf
(XA2C32A Datasheet)
http://direct.xilinx.com/bvdocs/publications/ds553.pdf
(XA2C64A Datasheet)
http://direct.xilinx.com/bvdocs/publications/ds554.pdf
(XA2C128 Datasheet)
Quality and Reliability Parameters
CoolRunner-II Automotive Requirements and Recommendations
Requirements
The following requirements are for all automotive applica-
tions:
1. Use a monotonic, fast ramp power supply to power up
2. Do not float I/O pins during device operation. Floating
3. Do not drive I/O pins without V
4. Sink current when driving LEDs. Because all Xilinx
12
Notes:
1.
2.
3.
4.
CoolRunner-II . A V
required.
I/O pins can increase I
1-2 mA per floating input. In addition, when I/O pins are
floated, noise can propagate to the center of the CPLD.
I/O pins should be appropriately terminated with
bus-hold or pull-up. Unused I/Os can also be configured
as C
CPLDs have N-channel pull-down transistors on
outputs, it is required that an LED anode is sourced
Symbol
Stresses above those listed may cause malfunction or permanent damage to the device. This is a stress rating only. Functional
operation at these or any other condition above those indicated in the operational and programming specification is not implied.
The chip supply voltage should rise monotonically.
Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0V or overshoot to 4.5 V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA. The I/O voltage may never exceed 4.0V.
For soldering guidelines and thermal considerations, see the
packages, see XAPP427.
T
N
DR
PE
Symbol
GND
V
T
T
V
CC
STR
J
I
(3)
(4)
(2)
(programmable GND).
Data retention
Program/erase cycles (Endurance)
CC
Supply voltage relative to GND
Input voltage relative to GND
Maximum junction temperature
Storage temperature (ambient)
CC
ramp time of less than 1 ms is
as input buffers will draw
CC
/V
Parameter
CCIO
(1)
powered.
Parameter
www.xilinx.com
Device Packaging
http://direct.xilinx.com/bvdocs/publications/ds555.pdf
(XA2C256 Datasheet)
http://direct.xilinx.com/bvdocs/publications/ds556.pdf
(XA2C384 Datasheet)
5. Avoid pull-down resistors. Always use external pull-up
6. Do not drive I/Os pins above the V
through a resistor externally to V
will give the brightest solution.
resistors if external termination is required. This is
because the CoolRunner-II Automotive CPLD, which
includes some I/O driving circuits beyond the input and
output buffers, may have contention with external
pull-down resistors, and, consequently, the I/O will not
switch as expected.
I/O bank.
a. The current flow can go into V
b. It can also increase undesired leakage current
c. If done for too long, it can reduce the life of the
voltage regulator.
associated with the device.
device.
information on the Xilinx website. For Pb-free
1,000
Min
20
–0.5
–0.5
Min.
–40
–65
Max
-
-
DS315 (v1.1) October 31, 2006
CC
CCIO
Product Specification
CCIO
. Consequently, this
Cycles
Max.
125
150
Units
Years
2.0
4.0
and affect a user
assigned to its
Unit
°C
°C
V
V
R

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