mpc8544e Freescale Semiconductor, Inc, mpc8544e Datasheet - Page 102

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mpc8544e

Manufacturer Part Number
mpc8544e
Description
Mpc8544e Powerquicc Iii Integrated Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Thermal
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure
interface pressure.
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
102
61). Therefore, the synthetic grease offers the best thermal performance, especially at the low
Chomerics, Inc. 781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation800-248-2481
Corporate Center
P.O.Box 999
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company800-347-4572
18930 West 78
1.5
0.5
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
2
1
0
Figure 63. Thermal Performance of Select Thermal Interface Materials
0
th
St.
10
Preliminary—Subject to Change Without Notice
20
Freescale Confidential Proprietary
Contact Pressure (psi)
30
40
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
70
Freescale Semiconductor
80

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