sc18is602b NXP Semiconductors, sc18is602b Datasheet - Page 21

• Manufacturer Part Number: sc18is602b
• Description: I2c-bus To Spi Bridge
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Abbreviations
SC18IS602B
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 16.
Acronym
CDM
CPU
EEPROM
ESD
GPIO
HBM
I/O
I
LSB
MM
MSB
SPI
2
Fig 22. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Charged Device Model
Central Processing Unit
Electrically Erasable Programmable Read-Only Memory
ElectroStatic Discharge
General Purpose Input/Output
Human Body Model
Input/Output
Inter-Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Serial Peripheral Interface
Rev. 5 — 3 August 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
SC18IS602B
peak
I
2
C-bus to SPI bridge
© NXP B.V. 2010. All rights reserved.
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