uja1076tw/5v0/wd NXP Semiconductors, uja1076tw/5v0/wd Datasheet
uja1076tw/5v0/wd
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uja1076tw/5v0/wd Summary of contents
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UJA1076 High-speed CAN core system basis chip Rev. 01 — 1 December 2009 1. General description The UJA1076 core System Basis Chip (SBC) replaces the basic discrete components commonly found in Electronic Control Units (ECU) with a high-speed Controller Area ...
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... NXP Semiconductors 2. Features 2.1 General Contains a full set of CAN ECU functions: CAN transceiver Scalable 3 voltage regulator delivering up to 250 mA for a microcontroller and peripheral circuitry; an external PNP transistor can be connected for better heat distribution over the PCB Separate voltage regulator for the CAN transceiver (5 V) ...
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... NXP Semiconductors 2.4 Control and Diagnostic features Safe and predictable behavior under all conditions Programmable watchdog with independent clock source: Window, Timeout (with optional cyclic wake-up) and Off modes supported (with automatic re-enable in the event of an interrupt) 16-bit Serial Peripheral Interface (SPI) for configuration, control and diagnosis Global enable output for controlling safety-critical hardware Limp home output (LIMP) for activating application-specific ‘ ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Name UJA1076TW/5V0/WD HTSSOP32 UJA1076TW/3V3/WD UJA1076TW/5V0 UJA1076TW/3V3 [1] UJA1076TW/5V0xx versions contain regulator (V1); UJA1076TW/3V3xx versions contain a 3.3 V regulator (V1); WD versions contain a watchdog. 4. Block diagram BAT GND SCK SDI SDO SCSN WAKE1 WAKE WAKE2 ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin configuration 5.2 Pin description Table 2. Symbol i.c. i.c. i.c. V1 i.c. RSTN INTN EN SDI SDO SCK SCSN TXDC RXDC TEST1 WDOFF LIMP UJA1076_1 Product data sheet i. i.c. 5 RSTN 6 INTN UJA1076 9 SDI 10 SDO SCK 11 SCSN 12 TXDC 13 14 RXDC ...
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... NXP Semiconductors Table 2. Symbol WAKE1 WAKE2 V2 CANH CANL GND SPLIT i.c. i.c. i.c. WBIAS VEXCC TEST2 VEXCTRL BAT The exposed die pad at the bottom of the package allows for better heat dissipation from the SBC via the printed circuit board. The exposed die pad is not connected to any active part of the IC and can be left floating, or can be connected to GND ...
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... NXP Semiconductors 6.1 System Controller 6.1.1 Introduction The system controller manages register configuration and controls the internal functions of the SBC. Detailed device status information is collected and presented to the microcontroller. The system controller also provides the reset and interrupt signals. The system controller is a state machine. The SBC operating modes, and how transitions between modes are triggered, are illustrated in more detail in the following sections ...
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... NXP Semiconductors V below BAT power-off threshold V th(det)poff (from all modes) V below BAT high resistance power-on threshold V th(det)pon watchdog: OFF V2: ON/OFF CAN: Active/Lowpower successful watchdog: Window/ watchdog trigger Fig 3. UJA1076 system controller UJA1076_1 Product data sheet Overtemp V1: OFF V2: OFF limp home = LOW (active) ...
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... NXP Semiconductors 6.1.4 Normal mode Normal mode is selected from Standby mode by setting bits MC in the Mode_Control register (Table In Normal mode, the CAN physical layer will be enabled (Active mode; STBCC = 0; see Table low-power state (Lowpower mode; STBCC = 1) with bus wake-up detection active. ...
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... NXP Semiconductors 6.2 SPI 6.2.1 Introduction The Serial Peripheral Interface (SPI) provides the communication link with the microcontroller, supporting multi-slave operations. The SPI is configured for full duplex data transfer, so status information is returned when new control data is shifted in. The interface also offers a read-only access option, allowing registers to be read back by the application without changing the register content ...
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... NXP Semiconductors 6.2.3 WD_and_Status register Table 4. WD_and_Status register Bit Symbol Access Power-on default 15:13 A2, A1 000 WMC R/W 0 [1] 10:8 NWP R/W 100 7 SWR/WOS R V1S V2S WLS1 WLS2 R - 2:0 reserved R 000 [1] Bit NWP is set to it’s default value (100) after a reset. ...
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... NXP Semiconductors 6.2.4 Mode_Control register Table 5. Mode_Control register Bit Symbol Access Power-on default 15:13 A2, A1 001 12 RO R/W 0 11:10 MC R/W 00 [1] 9 LHWC R/W 1 [2] 8 LHC R ENC R reserved WBC R PDC R/W 0 3:0 reserved R 0000 [1] Bit LHWC is set to 1 after a reset. [2] Bit LHC is set to 1 after a reset, if LHWC was set to 1 prior to the reset. ...
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... NXP Semiconductors 6.2.5 Int_Control register Table 6. Int_Control register Bit Symbol Access Power-on default 15:13 A2, A1 010 V1UIE R V2UIE R/W 0 9:8 reserved R 00 7:6 WIC1 R/W 00 5:4 WIC2 R STBCC R RTHC R WSE1 R/W 0 UJA1076_1 Product data sheet High-speed CAN core system basis chip Description ...
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... NXP Semiconductors Table 6. Int_Control register Bit Symbol Access Power-on default 0 WSE2 R/W 0 6.2.6 Int_Status register [1] Table 7. Int_Status register Bit Symbol Access Power-on default 15:13 A2, A1 011 V1UI R V2UI R/W 0 9:8 reserved R WI1 R POSI R WI2 R CWI R/W 0 2:0 reserved ...
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... NXP Semiconductors 6.3 On-chip oscillator The on-chip oscillator provides the timing reference for the on-chip watchdog and the internal timers. The on-chip oscillator is supplied by an internal supply that is connected to V and is independent of V1/V2. BAT 6.4 Watchdog (UJA1076/xx/WD versions) Three watchdog modes are supported: Window, Timeout and Off. The watchdog period is programmed via the NWP control bits in the WD_and_Status register (see default watchdog period is 128 ms ...
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... NXP Semiconductors 6.4.2 Watchdog Timeout behavior The watchdog runs continuously in Timeout mode. It can be reset at any time by a watchdog trigger. If the watchdog overflows, the cyclic interrupt (CI) bit is set already pending, a system reset is performed. The watchdog is in Timeout mode when pin WDOFF is LOW and: • ...
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... NXP Semiconductors 6.5.1 RSTN pin A system reset is triggered if the bidirectional RSTN pin is forced LOW for at least t the microcontroller (external reset). A reset pulse is output on RSTN by the SBC when a system reset is triggered internally. The reset pulse width (t generated undervoltage event (see (V > V BAT th(det)pon selected by connecting a 900 Ω ...
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... NXP Semiconductors 6.6 Power supplies 6.6.1 Battery pin (BAT) The SBC contains a single supply pin, BAT. An external diode is needed in series to protect the device against negative voltages. The operating range is from 4 The SBC can handle maximum voltages the voltage on pin BAT falls below the power-off detection threshold (V SBC immediately enters Off mode, which means that the voltage regulators and the internal logic are shut down ...
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... NXP Semiconductors load current I PNP current Fig 7. V1 and PNP currents at a slow ramping load current of 250 mA (PDC = 0) Figure 7 illustrates how V1 and the PNP transistor combine to supply a slow ramping load current of 250 mA with PDC = 0. Any additional load current requirement will be supplied by the PNP transistor its current limit ...
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... The thermal performance of the transistor needs to be considered when calculating the value of this resistor. A 3.3 Ω resistor was used with the BCP52-16 (NXP Semiconductors) employed during testing. Note that the selection of the transistor is not critical. In general, any PNP transistor with a current amplification factor (β) of between 60 and 500 can be used ...
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... NXP Semiconductors • the SBC is in Normal mode ( 11) • the transceiver is enabled (bit STBCC = 0; see and • enabled and its output voltage is above its undervoltage threshold • disabled but an external voltage source, or V1, connected to pin V2 is above its ...
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... NXP Semiconductors 6.7.2 Split circuit Pin SPLIT provides a DC stabilized voltage of 0.5V only. Pin SPLIT is floating in CAN Lowpower and Off modes. The V used to stabilize the recessive common-mode voltage by connecting pin SPLIT to the center tap of the split termination (see A transceiver in the network that is not supplied and that generates a significant leakage current from the bus lines to ground, can result in a recessive bus voltage of < ...
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... NXP Semiconductors mode. If the SBC is in Sleep mode when the wake-up event occurs, it will wake up and enter Standby mode. The status of the wake-up pins can be read via the wake-up level status bits (WLS1 and WLS2) in the WD_and_Status register Note that bits WLS1 and WLS2 are only active when at least one of the wake up interrupts is enabled (WIC1 ≠ ...
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... NXP Semiconductors 6.9 Interrupt output Pin INTN is an active-LOW, open-drain interrupt output driven LOW when at least one interrupt is pending. An interrupt can be cleared by writing 1 to the corresponding bit in the Int_Status register interrupt status bit and not the pending wake-up. The pending wake-up is cleared on entering Normal mode and when the corresponding standby control bit (STBCC ...
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... NXP Semiconductors 7. Limiting values Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions V voltage on pin x DC value x I reverse current from R(V1-BAT) pin V1 to pin BAT V transient voltage on pins trt V electrostatic IEC 61000-4-2 ESD discharge voltage ...
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... NXP Semiconductors Table 8. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions T ambient amb temperature [1] A reverse diode connected between V1 (anode) and BAT (cathode) limits the voltage drop voltage from V1(+) to BAT (-). [2] Verified by an external test house to ensure pins can withstand ISO 7637 part 2 automotive transient test pulses 1, 2a, 3a and 3b. ...
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... NXP Semiconductors 8. Thermal characteristics Layout conditions for R layer, board dimensions 129 × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm. Optional heat sink top layer of 3.5 mm × will reduce thermal resistance (see Fig 13 ...
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... NXP Semiconductors 90 R th(j-a) (K/ Fig 14. HTSSOP32 thermal resistance junction-to-ambient vs. PCB copper area UJA1076_1 Product data sheet without heatsink top layer with heatsink top layer Rev. 01 — 1 December 2009 UJA1076 High-speed CAN core system basis chip 015aaa138 PCB Cu heatsink area (cm ) © ...
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... NXP Semiconductors 9. Static characteristics Table 9. Static characteristics − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter Supply; pin BAT V battery supply voltage BAT I battery supply current ...
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... NXP Semiconductors Table 9. Static characteristics …continued − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter V external current control uvd(ctrl)Iext undervoltage detection voltage Voltage source; pin V1 V output voltage ...
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... NXP Semiconductors Table 9. Static characteristics …continued − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter I PNP activation threshold th(act)PNP current I PNP deactivation threshold th(deact)PNP current PNP collector; pin VEXCC ...
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... NXP Semiconductors Table 9. Static characteristics …continued − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter I input leakage current on pin LI(SDI) SDI Serial peripheral interface data output; pin SDO ...
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... NXP Semiconductors Table 9. Static characteristics …continued − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter I pull-down current pd Limp home output; pin LIMP I output current O Wake bias output; pin WBIAS ...
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... NXP Semiconductors Table 9. Static characteristics …continued − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter V differential receiver threshold th(RX)dif voltage V differential receiver hys(RX)dif hysteresis voltage ...
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... NXP Semiconductors 10. Dynamic characteristics Table 10. Dynamic characteristics − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter Voltage source; pin V1 t undervoltage detection delay d(uvd) time t LOW-level clamping detection ...
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... NXP Semiconductors Table 10. Dynamic characteristics − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter t delay time from TXDC LOW d(TXDCL-RXDCL) to RXDC LOW t delay time from TXDC to bus ...
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... NXP Semiconductors Table 10. Dynamic characteristics − ° °C to +150 4 BAT with respect to ground; positive currents flow in the IC; typical values are given at V Symbol Parameter Oscillator f oscillator frequency osc [1] A system reset will be performed if the watchdog is in Window mode and is triggered less than t period (or in the first half of the watchdog period) ...
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... NXP Semiconductors SCS t SPILEAD SCK SDI X floating SDO Fig 17. SPI timing 11. Test information 11.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 - Failure mechanism based stress test qualification for integrated circuits, and is suitable for use in automotive applications. ...
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... NXP Semiconductors 12. Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad y exposed die pad side pin 1 index 1 e DIMENSIONS (mm are the original dimensions). A UNIT max. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors temperature MSL: Moisture Sensitivity Level Fig 19. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. UJA1076_1 Product data sheet High-speed CAN core system basis chip maximum peak temperature ...
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... NXP Semiconductors 14. Revision history Table 13. Revision history Document ID Release date UJA1076_1 20091201 UJA1076_1 Product data sheet High-speed CAN core system basis chip Data sheet status Change notice Product data sheet - Rev. 01 — 1 December 2009 UJA1076 Supersedes - © NXP B.V. 2009. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 CAN transceiver . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 Power management . . . . . . . . . . . . . . . . . . . . . 2 2.4 Control and Diagnostic features . . . . . . . . . . . . 3 2.5 Voltage regulators Ordering information . . . . . . . . . . . . . . . . . . . . . 4 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 6 6.1 System Controller . . . . . . . . . . . . . . . . . . . . . . 7 6.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.1.2 Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.1.3 Standby mode 6.1.4 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 ...