tle8261-2e Infineon Technologies Corporation, tle8261-2e Datasheet - Page 81

• Manufacturer Part Number: tle8261-2e
• Description: Universal System Basis Chip Hermes
• Manufacturer: Infineon Technologies Corporation

16
Figure 41
Note: For the SBC product family the package PG-DSO-36-38 with the leadframe A6901-C003 is used.
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations, the Universal System Basis Chip is available as a green product. Green products are
RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-
020).
For information about packages and types of packing, refer to the
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
Package Outline
PG-DSO-36-38 (Leadframe A6901-003);)
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
3) Distance from leads bottom (= seating plane) to exposed diepad
4) Excluding the mold flash allowance of 0.3 max per side
Exposed Diepad Dimensions
Package
PG-DSO-36-24, -41, -42
PG-DSO-36-38
PG-DSO-36-38
PG-DSO-36-50
0.33
±0.08
17 x 0.65 = 11.05
36
2)
1
12.8
0.65
-0.2
0.17
1)
B
A
18
19
M
C
Leadframe
A6901-C001
A6901-C003
A6901-C007
A6901-C008 6.0 5.4
A-B
Ejector Mark
4)
SEATING PLANE
C
D
0.1
36x
C
5.2
Ex
7
7
36x
81
5.1
5.1
4.6
Ey
19
18
Bottom View
7.6
10.3
0.7
-0.2
Ex
0.35 x 45˚
±0.2
±0.3
1)
PG-DSO-36-24, -38, -41, -42, -50-PO V09
36
1
D
Exposed Diepad
Index Marking
Rev. 1.0, 2009-05-26
Dimensions in mm
Package Outline
TLE8261-2E