cbt3306d NXP Semiconductors, cbt3306d Datasheet - Page 11

• Manufacturer Part Number: cbt3306d
• Description: Cbt3306 Dual Bus Switch
• Manufacturer: NXP Semiconductors

Philips Semiconductors
15. Abbreviations
16. Revision history
Table 12:
CBT3306_2
Product data sheet
Document ID
CBT3306_2
Modifications:
CBT3306_1
Revision history
Release date
20051117
20011108
•
•
•
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
Table 1 “Quick reference
– added Min and Max columns; moved t
– under ‘Conditions’ for C
Table 5 “Limiting
– changed parameter description for I
– deleted old table note [3]
Table 7 “Static
– changed symbol for input leakage current from “I
– under ‘Conditions’ for C
– R
[4]
[5]
[6]
[7]
[8]
[9]
Table 11:
Acronym
CDM
ESD
FET
HBM
PRR
TTL
“15 ”
on
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
maximum value for condition V
Data sheet status
Product data sheet
Product data
Abbreviations
characteristics”:
values”:
Description
Charged Device Model
ElectroStatic Discharge
Field Effect Transistor
Human Body Model
Pulse Rate Repetition
Transistor-Transistor Logic
data”:
Rev. 02 — 17 November 2005
io(off)
io(off)
: changed “V
: changed “V
CC
IK
Change notice
-
853-2304 27313
from “diode current” to “input clamping current”
= 4.5 V; V
PD
O
O
and I
” to “V
” to “V
CC
I
I
I
I
”
”
= 2.4 V; I
” to “I
values to Max column
LI
Doc. number
CBT3306_2
9397 750 09115
”
I
= 15 mA: changed from “7.5 ” to
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Supersedes
CBT3306_1
-
CBT3306
Dual bus switch
11 of 13