is62lv256al Integrated Silicon Solution, Inc., is62lv256al Datasheet

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is62lv256al

Manufacturer Part Number
is62lv256al
Description
32k X 8 Low Voltage Cmos Static Ram
Manufacturer
Integrated Silicon Solution, Inc.
Datasheet

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IS65LV256AL
IS62LV256AL
32K x 8 LOW VOLTAGE
CMOS STATIC RAM
FEATURES
• High-speed access time: 20, 45 ns
• Automatic power-down when chip is deselected
• CMOS low power operation
• TTL compatible interface levels
• Single 3.3V power supply
• Fully static operation: no clock or refresh
• Three-state outputs
• Industrial and Automotive temperatures avail-
• Lead-free available
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. B
10/23/06
FUNCTIONAL BLOCK DIAGRAM
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
— 17 µW (typical) CMOS standby
— 50 mW (typical) operating
required
able
I/O0-I/O7
A0-A14
GND
VDD
CE
OE
WE
DECODER
CIRCUIT
CONTROL
CIRCUIT
DATA
I/O
1-800-379-4774
DESCRIPTION
The
power, 32,768-word by 8-bit static RAM. It is fabricated
using
highly reliable process coupled with innovative circuit
design techniques, yields access times as fast as 15 ns
maximum.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation is reduced to
150 µW (typical) with CMOS input levels.
Easy memory expansion is provided by using an active
LOW Chip Enable (CE). The active LOW Write Enable
(WE) controls both writing and reading of the memory.
The IS62/65LV256AL is available in the JEDEC standard
28-pin SOJ, 28-pin SOP, and the 28-pin 450-mil TSOP
package.
ISSI
ISSI
MEMORY ARRAY
's high-performance CMOS technology. This
IS62/65LV256AL is a very high-speed, low
COLUMN I/O
32K x 8
OCTOBER 2006
ISSI
®
1

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is62lv256al Summary of contents

Page 1

... IS65LV256AL IS62LV256AL 32K x 8 LOW VOLTAGE CMOS STATIC RAM FEATURES • High-speed access time: 20 • Automatic power-down when chip is deselected • CMOS low power operation — 17 µW (typical) CMOS standby — (typical) operating • TTL compatible interface levels • Single 3.3V power supply • ...

Page 2

... IS65LV256AL IS62LV256AL PIN CONFIGURATION 28-Pin SOJ/ 28-pin SOP A14 1 28 VDD WE A12 A13 A11 A10 I/O7 I/ I/O6 I/ I/O5 I/ I/O4 GND 14 15 I/O3 PIN DESCRIPTIONS A0-A14 Address Inputs CE Chip Enable Input ...

Page 3

... IS65LV256AL IS62LV256AL OPERATING RANGE Part No. Range IS62LV256AL Commercial IS62LV256AL Industrial IS65LV256AL Automotive DC ELECTRICAL CHARACTERISTICS Symbol Parameter V Output HIGH Voltage OH V Output LOW Voltage OL V Input HIGH Voltage IH (1) V Input LOW Voltage IL I Input Leakage LI I Output Leakage LO Notes –3.0V for pulse width less than 10 ns. ...

Page 4

... IS65LV256AL IS62LV256AL POWER SUPPLY CHARACTERISTICS Symbol Parameter I V Operating Supply Current I V Dynamic Operating Supply Current I TTL Standby Current 1 SB (TTL Inputs) I CMOS Standby 2 SB Current (CMOS Inputs) Note address and data inputs are cycling at the maximum frequency means no input lines change. ...

Page 5

... IS65LV256AL IS62LV256AL READ CYCLE SWITCHING CHARACTERISTICS Symbol Parameter t Read Cycle Time RC t Address Access Time AA t Output Hold Time OHA CE Access Time t ACE OE Access Time t DOE OE to Low-Z Output t (2) LZOE OE to High-Z Output t (2) HZOE CE to Low-Z Output t (2) LZCE ...

Page 6

... IS65LV256AL IS62LV256AL AC WAVEFORMS (1,2) READ CYCLE NO. 1 ADDRESS D OUT (1,3) READ CYCLE NO. 2 ADDRESS OUT SUPPLY CURRENT Notes HIGH for a Read Cycle. 2. The device is continuously selected. OE Address is valid prior to or coincident with CE LOW transitions OHA t RC ...

Page 7

... IS65LV256AL IS62LV256AL WRITE CYCLE SWITCHING CHARACTERISTICS Symbol Parameter t Write Cycle Time Write End t SCE t Address Setup Time to Write End AW t Address Hold from Write End HA t Address Setup Time SA WE Pulse Width t (4) PWE t Data Setup to Write End SD t Data Hold from Write End ...

Page 8

... IS65LV256AL IS62LV256AL Controlled) CE WRITE CYCLE NO. 2 (CE ADDRESS OUT D IN Notes: 1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the Write ...

Page 9

... IS65LV256AL IS62LV256AL DATA RETENTION SWITCHING CHARACTERISTICS Symbol Parameter V V for Data Retention Data Retention Current DR t Data Retention Setup Time See Data Retention Waveform SDR t Recovery Time RDR Note: 1. Typical Values are measured 3.3V DATA RETENTION WAVEFORM (CE VDD V DR ...

Page 10

... IS62LV256AL-45T IS62LV256AL-45TL IS62LV256AL-45J Industrial Range: –40°C to +85°C Speed (ns) Order Part No. 20 IS62LV256AL-20TI IS62LV256AL-20TLI IS62LV256AL-20JI IS62LV256AL-20JLI 45 IS62LV256AL-45TI IS62LV256AL-45TLI IS62LV256AL-45JI IS62LV256AL-45UI IS62LV256AL-45ULI Automotive Range: –40°C to +125°C Speed (ns) Order Part No. 45 IS65LV256AL-45TA3 IS65LV256AL-45TLA3 450-mil TSOP, Lead-free IS65LV256AL-45UA3 IS65LV256AL-45ULA3 330-mil Plastic SOP, Lead-free ...

Page 11

... C 0.10 0.20 D 7.90 8.10 E 11.70 11.90 H 13.20 13.60 e 0.55 BSC L 0.30 0. Integrated Silicon Solution, Inc. PK13197T28 Rev. B 01/31/ SEATING PLANE Inches Min Max Notes Controlling dimension: millimeters, unless otherwise specified. 0.037 0.047 2. BSC = Basic lead spacing between centers. 0.002 0.008 3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package 0 ...

Page 12

... BSC Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — ...

Page 13

... B — 0.010 C — 0.730 D 20.83 — 0.345 E — 0.305 E1 — 0.287 E2 e Integrated Silicon Solution, Inc. — www.issi.com — ISSI MILLIMETERS INCHES Min. Typ. Max. 32 — — 3.56 — — 0.140 0.64 — — 0.025 — 2.41 — 2.67 0.095 — 0.105 0.41 — ...

Page 14

... Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. — ...

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