w9425g6eb Winbond Electronics Corp America, w9425g6eb Datasheet - Page 50

• Manufacturer Part Number: w9425g6eb
• Description: 4 M ? 4 Banks ? 16 Bits Ddr Sdram
• Manufacturer: Winbond Electronics Corp America

12. PACKAGE SPECIFICATION
12.1 Package Outline TFBGA 60 Ball (8x13 mm
S
0.1
S
Package Type: 60 Ball CSP
Note: Solder ball is ψ0.45mm before reflow
E
E1
B
e1
//
“
F
A
0.2
＂
S
0.20
0.20
Detail
C
M
A
S B
“
- 50 -
A
＂
0.10
0.20
C
ψ0.15
ψ0.08
M
A1
S
2
A
)
M
M
S
S
A
A
C
//
B
Publication Release Date:Feb. 12, 2009
0.1
Symbol
Solder Ball
60x ψb
ψb
D1
A1
E1
e1
e2
A
D
E
F
C
0.311
0.016
0.507
0.003
Dimension in inch
0.01
Min
---
---
---
---
---
Nom Max
0.512
0.433
0.315
0.252
0.031
0.039
---
---
---
---
W9425G6EB
0.051
0.016
0.515
0.318 7.9
0.02
---
---
---
---
---
0.25
0.40
12.9
Dimension in mm
Min
0.1
---
---
---
---
---
Revision A02
Nom Max
13.0
11.0
6.40
0.80
1.00
8.0
---
---
---
---
1.20
0.40
0.50
13.1
8.1
---
---
---
---
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