tza3014 NXP Semiconductors, tza3014 Datasheet - Page 19

• Manufacturer Part Number: tza3014
• Description: 2.5 Gbits/s Postamplifier With Level Detector
• Manufacturer: NXP Semiconductors

Philips Semiconductors
2001 Jun 25
handbook, full pagewidth
2.5 Gbits/s postamplifier with level detector
In order to enable heat flow out of the package, the following measures have to be taken:
(1) Solder the 3
(2) Add a plane with minimum 100 mm
(3) Use maximum amount of vias to connect two planes.
(4) Use minimum of openings in heat transport area between hot plane and ground planes.
3 mm
2
exposed die pad to a plane with maximum size.
Fig.11 PCB layout for HTQFP package with positive supply voltage.
0603
0
INQ
IN
To central
GND decoupling
V CCA
V CCA
0603
1
2
in an inner layer, surrounded by ground layers.
0603
Boundary of 100 mm
2
0603
0603
3
0603
4
0603
0603
2
area
5 mm
19
To central
GND decoupling
HTQFP
V CCB
V CCB
0603
OUT
OUTQ
cross-section
MGU134
Product specification
TZA3014