hip6603cb Intersil Corporation, hip6603cb Datasheet - Page 8

• Manufacturer Part Number: hip6603cb
• Description: Synchronous-rectified Buck Mosfet Drivers
• Manufacturer: Intersil Corporation

NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
xx xx
xx
xx
xx
xx xx
xx
Small Outline Plastic Packages (SOIC)
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: [phone]
FAX: [phone]
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
are not necessarily exact.
2
-A-
xx
INDEX
AREA
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
3
e
B
D
M
C A
xxxxxxxx
For information regarding Intersil Corporation and its products, see web site www.intersil.com
SEATING PLANE
M
-C-
x
E
x x
-B-
B S
A
H
A1
8
0.10(0.004)
0.25(0.010)
M
L
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: [phone]
FAX: [phone]
h x 45
B
M
o
HIP6601, HIP6603
C
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
e
h
L
(JEDEC MS-012-AA ISSUE C)
0.0532
0.0040
0.013
0.0075
0.1890
0.1497
0.2284
0.0099
0.016
MIN
0
0.050 BSC
o
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: [phone]
FAX: [phone]
INCHES
8
MAX
0.0688
0.0098
0.020
0.0098
0.1968
0.1574
0.2440
0.0196
0.050
8
o
MILLIMETERS
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.25
0.40
MIN
0
o
1.27 BSC
8
MAX
1.75
0.25
0.51
0.25
5.00
4.00
6.20
0.50
1.27
8
o
Rev. 0 12/93
NOTES
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3
4
5
6
7
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