sc16is760ipw NXP Semiconductors, sc16is760ipw Datasheet - Page 56

• Manufacturer Part Number: sc16is760ipw
• Description: Single Uart With I2c-bus/spi Interface, 64 Bytes Of Transmit And Receive Fifos, Irda Sir Built-in Support
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Fig 43. Package outline SOT355-1 (TSSOP24)
SC16IS740_750_760_5
Product data sheet
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT355-1
max.
1.1
A
24
1
0.15
0.05
A
Z
1
y
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
REFERENCES
Rev. 05 — 16 November 2006
Single UART with I
D
b
7.9
7.7
0
(1)
p
13
12
E
4.5
4.3
w
(2)
M
JEITA
scale
0.65
2.5
e
c
H
6.6
6.2
E
A
2
2
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
5 mm
A
L
1
1
0.75
0.50
SC16IS740/750/760
L
p
H
E
E
0.4
0.3
detail X
Q
PROJECTION
L
EUROPEAN
0.2
L
v
p
Q
0.13
w
A
(A )
3
0.1
© NXP B.V. 2006. All rights reserved.
X
y
v
A
ISSUE DATE
M
99-12-27
03-02-19
0.5
0.2
A
Z
(1)
SOT355-1
8
0
o
o
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