saa5249 NXP Semiconductors, saa5249 Datasheet - Page 9
saa5249
Manufacturer Part Number
saa5249
Description
Integrated Vip And Teletext With Background Memory Controller Ivt1.1bmcx
Manufacturer
NXP Semiconductors
Datasheet
1.SAA5249.pdf
(44 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
saa5249P/E
Manufacturer:
TOSHIBA
Quantity:
6 232
Company:
Part Number:
saa5249P/R
Manufacturer:
PHI
Quantity:
6 234
Philips Semiconductors
Group A
Table 1 Acceptance tests per lot
Group B
Table 2 Processability tests (by package family)
Group C
Table 3 Reliability tests (by process family)
Table 4 Reliability tests (by device type)
Note to Tables 1 to 4
1. ppm = fraction of defective devices, in parts per million.
1996 Nov 07
Mechanical
Electrical
Solderability
Mechanical
Solder heat resistance
Operational life
Humidity life
Temperature cycling performance
ESD and latch-up
Integrated VIP and Teletext with
Background Memory Controller
LTPD = Lot Tolerance Percent Defective.
FPM = fraction of devices failing at test condition, in Failures Per Million.
FITS = Failures In Time Standard.
TEST
TEST
TEST
TEST
168 hours at T
temperature, humidity, bias
(1000 hours, 85 C, 85% RH or
equivalent test)
T
ESD Human body model
2000 V, 100 pF, 1.5 k
ESD Machine model
200 V, 100 pF, 1.5 k
latch-up 100 mA, 1.5
(absolute maximum)
stg(min)
to T
CONDITIONS
CONDITIONS
stg(max)
j
= 150 C
9
cumulative target: <100 ppm
cumulative target: <100 ppm
<7% LTPD
<15% LTPD
<15% LTPD
V
DD
REQUIREMENTS
REQUIREMENTS
<1500 FPM; equivalent to <100 FITS
at T
<2000 FPM
<2000 FPM
<15% LTPD
<15% LTPD
<15% LTPD
j
= 70 C
REQUIREMENTS
REQUIREMENTS
Preliminary specification
(1)
(1)
SAA5249
(1)
(1)