k4x56163p-lg Samsung Semiconductor, Inc., k4x56163p-lg Datasheet - Page 11

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k4x56163p-lg

Manufacturer Part Number
k4x56163p-lg
Description
16mx16 Mobile Ddr Sdram
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
K4X56163PI - L(F)E/G
3) IDD specifications are tested after the device is properly intialized.
4) Input slew rate is 1V/ns.
5) Definitions for IDD: LOW is defined as V
12. DC CHARACTERISTICS
Recommended operating conditions (Voltage referenced to V
NOTE :
1) It has +/- 5qC tolerance.
2) DPD(Deep Power Down) function is an optional feature, and it will be enabled upon request.
Operating Current
(One Bank Active)
Precharge Standby Current
in power-down mode
Precharge Standby Current
in non power-down mode
Active Standby Current
in power-down mode
Active Standby Current
in non power-down mode
(One Bank Active)
Operating Current
(Burst Mode)
Refresh Current
Self Refresh Current
Deep Power Down Current
Please contact Samsung for more information.
Parameter
HIGH is defined as V
STABLE is defined as inputs stable at a HIGH or LOW level ;
SWITCHING is defined as: - address and command: inputs changing between HIGH and LOW once per two clock cycles ;
Symbol
IDD2PS
IDD2NS
IDD3PS
IDD3NS
IDD4W
IDD2N
IDD3N
IDD4R
IDD2P
IDD3P
IDD0
IDD5
IDD6
IDD8
tRC=tRCmin; tCK=tCKmin; CKE is HIGH; CS is HIGH between valid com-
mands; address inputs are SWITCHING; data bus inputs are STABLE
all banks idle, CKE is LOW; CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus inputs are STABLE
all banks idle, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH;/
address and control inputs are SWITCHING; data bus inputs are STABLE
all banks idle, CKE is HIGH; CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus inputs are STABLE
all banks idle, CKE is HIGH; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
one bank active, CKE is LOW; CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus inputs are STABLE
one bank active, CKE is LOW; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
one bank active, CKE is HIGH; CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus inputs are STABLE
one bank active, CKE is HIGH; CS is HIGH, CK = LOW, CK = HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
one bank active; BL=4; CL=3; tCK = tCKmin; continuous read bursts;
I
address inputs are SWITCHING; 50% data change each burst transfer
one bank active; BL = 4; tCK = tCKmin ; continuous write bursts;
address inputs are SWITCHING; 50% data change each burst transfer
tRC = tRFCmin ; tCK = tCKmin ; burst refresh; CKE is HIGH;
address and control inputs are SWITCHING; data bus inputs are STABLE
CKE is LOW; t CK = t CKmin ;
Extended Mode Register set to all 0’s;
address and control inputs are STABLE;
data bus inputs are STABLE
Deep Power Down Mode Current
IN
OUT
IN
t 0.9 * VDDQ ;
d0.1 * VDDQ ;
=0 mA;
- data bus inputs: DQ changing between HIGH and LOW once per clock cycle; DM and DQS are STABLE.
SS
= 0V, Tc = -25 to 85qC)
Test Condition
- 14 -
- E
- G
Parameter
Full Array
Full Array
1/2 Array
1/4 Array
1/2 Array
1/4 Array
Mobile DDR SDRAM
DDR333 DDR266 Unit Note
45
110
100
200
160
140
150
135
130
50
15
25
20
90
8
1)
0.3
0.3
10
5
2
450
300
250
300
250
225
45
12
25
20
95
75
85
85
8
October 2007
mA
mA
mA
mA
mA
mA
mA
uA
uA
qC
2

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